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XCF04SVOG20

更新时间： 2024-01-16 19:22:03
品牌 Logo 应用领域
赛灵思 - XILINX 可编程只读存储器
页数 文件大小 规格书
42页 356K
描述
Platform Flash In-System Programmable Configuration PROMS

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XCF04SVOG20 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：TSSOP
包装说明：TSSOP,针数：20
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.32.00.51风险等级：5.49
JESD-30 代码：R-PDSO-G20JESD-609代码：e3
长度：6.5024 mm内存密度：4194304 bit
内存集成电路类型：CONFIGURATION MEMORY内存宽度：1
湿度敏感等级：3功能数量：1
端子数量：20字数：4194304 words
字数代码：4000000工作模式：SYNCHRONOUS
最高工作温度：85 °C最低工作温度：-40 °C
组织：4MX1封装主体材料：PLASTIC/EPOXY
封装代码：TSSOP封装形状：RECTANGULAR
封装形式：SMALL OUTLINE, THIN PROFILE, SHRINK PITCH并行/串行：SERIAL
峰值回流温度（摄氏度）：260认证状态：Not Qualified
座面最大高度：1.19 mm最大供电电压 (Vsup)：3.6 V
最小供电电压 (Vsup)：3 V标称供电电压 (Vsup)：3.3 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子面层：MATTE TIN
端子形式：GULL WING端子节距：0.65 mm
端子位置：DUAL处于峰值回流温度下的最长时间：30
宽度：4.4 mm

XCF04SVOG20 数据手册

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4
2
R
Platform Flash In-System Programmable  
Configuration PROMS  
0
DS123 (v2.6) March 14, 2005  
Preliminary Product Specification  
Features  
•
In-System Programmable PROMs for Configuration of  
Xilinx FPGAs  
•
•
XCF01S/XCF02S/XCF04S  
-
-
-
3.3V supply voltage  
•
•
•
Low-Power Advanced CMOS NOR FLASH Process  
Endurance of 20,000 Program/Erase Cycles  
Serial FPGA configuration interface (up to 33 MHz)  
Available in small-footprint VO20 and VOG20  
packages.  
Operation over Full Industrial Temperature Range  
(–40°C to +85°C)  
XCF08P/XCF16P/XCF32P  
-
-
1.8V supply voltage  
Serial or parallel FPGA configuration interface  
(up to 33 MHz)  
Available in small-footprint VO48, VOG48, FS48,  
and FSG48 packages  
Design revision technology enables storing and  
accessing multiple design revisions for  
configuration  
•
•
IEEE Standard 1149.1/1532 Boundary-Scan (JTAG)  
Support for Programming, Prototyping, and Testing  
JTAG Command Initiation of Standard FPGA  
Configuration  
-
-
•
•
Cascadable for Storing Longer or Multiple Bitstreams  
Dedicated Boundary-Scan (JTAG) I/O Power Supply  
(VCCJ  
)
•
•
I/O Pins Compatible with Voltage Levels Ranging From  
1.5V to 3.3V  
-
Built-in data decompressor compatible with Xilinx  
advanced compression technology  
Design Support Using the Xilinx Alliance ISE and  
Foundation ISE Series Software Packages  
Table 1: Platform Flash PROM Features  
JTAG ISP  
Serial Parallel  
Design  
Density  
V
V
Range  
V Range  
CCJ  
Packages  
Compression  
CCINT  
CCO  
Programming Config. Config. Revisioning  
XCF01S 1 Mbit  
XCF02S 2 Mbit  
XCF04S 4 Mbit  
3.3V  
3.3V  
3.3V  
VO20/VOG20  
VO20/VOG20  
VO20/VOG20  
1.8V - 3.3V 2.5V - 3.3V  
1.8V - 3.3V 2.5V - 3.3V  
1.8V - 3.3V 2.5V - 3.3V  
√
√
√
√
√
√
VO48/VOG48  
FS48/FSG48  
XCF08P 8 Mbit  
XCF16P 16 Mbit  
XCF32P 32 Mbit  
1.8V  
1.8V  
1.8V  
1.5V - 3.3V 2.5V - 3.3V  
√
√
√
√
√
√
√
√
√
√
√
√
√
√
√
VO48/VOG48  
FS48/FSG48  
1.5V - 3.3V  
2.5V - 3.3V  
VO48/VOG48  
FS48/FSG48  
1.5V - 3.3V 2.5V - 3.3V  
Description  
Xilinx introduces the Platform Flash series of in-system pro-  
grammable configuration PROMs. Available in 1 to 32  
Megabit (Mbit) densities, these PROMs provide an  
easy-to-use, cost-effective, and reprogrammable method  
for storing large Xilinx FPGA configuration bitstreams. The  
Platform Flash PROM series includes both the 3.3V  
XCFxxS PROM and the 1.8V XCFxxP PROM. The XCFxxS  
version includes 4-Mbit, 2-Mbit, and 1-Mbit PROMs that  
support Master Serial and Slave Serial FPGA configuration  
modes (Figure 1). The XCFxxP version includes 32-Mbit,  
16-Mbit, and 8-Mbit PROMs that support Master Serial,  
Slave Serial, Master SelectMAP, and Slave SelectMAP  
FPGA configuration modes (Figure 2). A summary of the  
Platform Flash PROM family members and supported fea-  
tures is shown in Table 1.  
© 2005 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.  
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.  
DS123 (v2.6) March 14, 2005  
www.xilinx.com  
1
Preliminary Product Specification  
 
 
 
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