生命周期: | Transferred | 零件包装代码: | BGA |
包装说明: | BGA, | 针数: | 360 |
Reach Compliance Code: | unknown | ECCN代码: | 3A001.A.3 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.49 |
地址总线宽度: | 36 | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 133 MHz |
外部数据总线宽度: | 64 | 格式: | FLOATING POINT |
集成缓存: | YES | JESD-30 代码: | S-CBGA-B360 |
长度: | 25 mm | 低功率模式: | YES |
端子数量: | 360 | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | BGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 认证状态: | Not Qualified |
座面最大高度: | 3.2 mm | 速度: | 1000 MHz |
最大供电电压: | 1.35 V | 最小供电电压: | 1.25 V |
标称供电电压: | 1.3 V | 表面贴装: | YES |
技术: | CMOS | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
宽度: | 25 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
XC7445ARX733LF | NXP |
获取价格 |
32-BIT, 733MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | |
XC7445ARX733LF | MOTOROLA |
获取价格 |
32-BIT, 733MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | |
XC7445ARX733LG | NXP |
获取价格 |
32-BIT, 733MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | |
XC7445ARX867LF | MOTOROLA |
获取价格 |
RISC Microprocessor, 32-Bit, 867MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BG | |
XC7445ARX867LF | NXP |
获取价格 |
32-BIT, 867MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | |
XC7445ARX867LG | NXP |
获取价格 |
32-BIT, 867MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | |
XC7445ARX933LF | MOTOROLA |
获取价格 |
RISC Microprocessor, 32-Bit, 933MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BG | |
XC7445ARX933LG | NXP |
获取价格 |
32-BIT, 933MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | |
XC7445B | FREESCALE |
获取价格 |
RISC Microprocessor Hardware Specifications | |
XC7455ARX1000LF | NXP |
获取价格 |
32-BIT, 1000MHz, RISC PROCESSOR, CBGA483, 29 X 29 MM, 1.27 MM PITCH, CERAMIC, BGA-483 |