是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | PLASTIC, BGA-225 |
针数: | 225 | Reach Compliance Code: | not_compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.92 |
Is Samacsys: | N | 其他特性: | 144 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 276 FLIP-FLOPS |
最大时钟频率: | 55.6 MHz | 系统内可编程: | NO |
JESD-30 代码: | S-PBGA-B225 | JESD-609代码: | e0 |
JTAG BST: | NO | 长度: | 27 mm |
湿度敏感等级: | 3 | 专用输入次数: | 12 |
I/O 线路数量: | 120 | 宏单元数: | 144 |
端子数量: | 225 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 12 DEDICATED INPUTS, 120 I/O |
输出函数: | MACROCELL | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装等效代码: | BGA225,15X15 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
电源: | 3.3/5,5 V | 可编程逻辑类型: | OT PLD |
传播延迟: | 30 ns | 认证状态: | Not Qualified |
座面最大高度: | 3.5 mm | 子类别: | Programmable Logic Devices |
最大供电电压: | 5.5 V | 最小供电电压: | 4.5 V |
标称供电电压: | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Lead (Sn63Pb37) | 端子形式: | BALL |
端子节距: | 1.5 mm | 端子位置: | BOTTOM |
宽度: | 27 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
XC73144-12PG184C | XILINX |
获取价格 |
UV PLD, 30ns, CMOS, CPGA184, WINDOWED, CERAMIC, PGA-184 | |
XC73144-12PG184I | XILINX |
获取价格 |
UV PLD, 30ns, CMOS, CPGA184, WINDOWED, CERAMIC, PGA-184 | |
XC73144-12PG184M | XILINX |
获取价格 |
UV PLD, CMOS, CPGA184, | |
XC73144-12PQ160I | XILINX |
获取价格 |
OT PLD, 30ns, 144-Cell, CMOS, PQFP160, PLASTIC, QFP-160 | |
XC73144-12WB225C | ETC |
获取价格 |
UV-Erasable/OTP Complex PLD | |
XC73144-12WB225I | ETC |
获取价格 |
UV-Erasable/OTP Complex PLD | |
XC73144-15 | XILINX |
获取价格 |
144-Macrocell CMOS EPLD | |
XC73144-15BG225C | XILINX |
获取价格 |
OT PLD, 36ns, 144-Cell, CMOS, PBGA225, PLASTIC, BGA-225 | |
XC73144-15BG225I | XILINX |
获取价格 |
OT PLD, 36ns, 144-Cell, CMOS, PBGA225, PLASTIC, BGA-225 | |
XC73144-15PG184C | XILINX |
获取价格 |
UV PLD, 36ns, CMOS, CPGA184, WINDOWED, CERAMIC, PGA-184 |