Datasheet > XC2VP7-6FF896I

XC2VP7-6FF896I

更新时间： 2024-11-19 08:08:51

品牌	Logo	应用领域
赛灵思 - XILINX		栅
页数	文件大小	规格书
432页	2498K
描述
Field Programmable Gate Array, 1232 CLBs, 1200MHz, 11088-Cell, CMOS, PBGA896, 31 X 31 MM, 1 MM PITCH, MS-034AAN-1, FCBGA-896

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替代型号

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XC2VP7-6FF896I 数据手册

Product Not Recommended For New Designs

¹Virtex-II Pro and Virtex-II Pro X Platform FPGAs:

Complete Data Sheet

DS083 (v5.0) June 21, 2011

Product Specification

Module 1:

Introduction and Overview

Module 3:

DC and Switching Characteristics

10 pages

59 pages

•

Summary of Features

General Description

Architecture

IP Core and Reference Support

Device/Package Combinations and Maximum I/O

Ordering Information

•

Electrical Characteristics

Performance Characteristics

Switching Characteristics

Pin-to-Pin Output Parameter Guidelines

Pin-to-Pin Input Parameter Guidelines

DCM Timing Parameters

Source-Synchronous Switching Characteristics

Module 2:

Module 4:

Pinout Information

Functional Description

60 pages

302 pages

•

Functional Description: RocketIO™ X Multi-Gigabit

Transceiver

Functional Description: RocketIO Multi-Gigabit

Transceiver

Functional Description: Processor Block

Functional Description: PowerPC™ 405 Core

Functional Description: FPGA

•

Pin Definitions

Pinout Tables

•

FG256/FGG256 Wire-Bond Fine-Pitch BGA Package

•

FG456/FGG456 Wire-Bond Fine-Pitch BGA Package

FG676/FGG676 Wire-Bond Fine-Pitch BGA Package

FF672 Flip-Chip Fine-Pitch BGA Package

FF896 Flip-Chip Fine-Pitch BGA Package

FF1148 Flip-Chip Fine-Pitch BGA Package

FF1152 Flip-Chip Fine-Pitch BGA Package

FF1517 Flip-Chip Fine-Pitch BGA Package

FF1696 Flip-Chip Fine-Pitch BGA Package

FF1704 Flip-Chip Fine-Pitch BGA Package

Input/Output Blocks (IOBs)

Digitally Controlled Impedance (DCI)

On-Chip Differential Termination

Configurable Logic Blocks (CLBs)

3-State Buffers

CLB/Slice Configurations

18-Kb Block SelectRAM™ Resources

18-Bit x 18-Bit Multipliers

Global Clock Multiplexer Buffers

Digital Clock Manager (DCM)

•

Routing

Configuration

IMPORTANT NOTE: Page, figure, and table numbers begin at 1 for each module, and each module has its own Revision

History at the end. Use the PDF "Bookmarks" pane for easy navigation in this volume.

a trademark of IBM Corp. and is used under license. All other trademarks are the property of their respective owners.

DS083 (v5.0) June 21, 2011

www.xilinx.com

Product Specification

12 3 4 5 6 7...432

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XC2VP7-6FF896I 替代型号

型号	品牌	替代类型	描述	数据表
XC2VP7-5FFG896I	XILINX	完全替代	Field Programmable Gate Array, 1232 CLBs, 1050MHz, 11088-Cell, CMOS, PBGA896, 31 X 31 MM,
XC2VP7-5FFG896C	XILINX	完全替代	Field Programmable Gate Array, 1232 CLBs, 1050MHz, 11088-Cell, CMOS, PBGA896, 31 X 31 MM,

与XC2VP7-6FF896I相关器件

型号	品牌	获取价格	描述	数据表
XC2VP7-6FFG672C	XILINX	获取价格	Field Programmable Gate Array, 1232 CLBs, 1200MHz, 11088-Cell, CMOS, PBGA672, 27 X 27 MM,
XC2VP7-6FFG672I	XILINX	获取价格	Field Programmable Gate Array, 1232 CLBs, 1200MHz, 11088-Cell, CMOS, PBGA672, 27 X 27 MM,
XC2VP7-6FFG896C	XILINX	获取价格	Field Programmable Gate Array, 1232 CLBs, 1200MHz, 11088-Cell, CMOS, PBGA896, 31 X 31 MM,
XC2VP7-6FG456C	XILINX	获取价格	Field Programmable Gate Array, 1232 CLBs, 1200MHz, 11088-Cell, CMOS, PBGA456, 23 X 23 MM,
XC2VP7-6FGG456I	XILINX	获取价格	Field Programmable Gate Array, 1232 CLBs, 1200MHz, 11088-Cell, CMOS, PBGA456, 23 X 23 MM,
XC2VP7-7FF672C	XILINX	获取价格	Field Programmable Gate Array, 1232 CLBs, 1350MHz, 11088-Cell, CMOS, PBGA672, 27 X 27 MM,
XC2VP7-7FFG672C	XILINX	获取价格	Field Programmable Gate Array, 1232 CLBs, 1350MHz, 11088-Cell, CMOS, PBGA672, 27 X 27 MM,
XC2VP7-7FFG896I	XILINX	获取价格	Field Programmable Gate Array, 1232 CLBs, 1350MHz, CMOS, PBGA896, 1 MM PITCH, FLIP CHIP, F
XC2VP7-7FG456C	XILINX	获取价格	Field Programmable Gate Array, 1232 CLBs, 1350MHz, 11088-Cell, CMOS, PBGA456, 23 X 23 MM,
XC2VP7-7FG456I	XILINX	获取价格	Field Programmable Gate Array, 1232 CLBs, 1350MHz, 11088-Cell, CMOS, PBGA456, 1 MM PITCH,

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