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WTS701MF/T PDF预览

WTS701MF/T

更新时间: 2024-11-26 22:10:07
品牌 Logo 应用领域
华邦 - WINBOND /
页数 文件大小 规格书
77页 527K
描述
WINBOND SINGLE-CHIP TEXT-TO-SPEECH PROCESSOR

WTS701MF/T 技术参数

生命周期:Obsolete零件包装代码:TSOP1
包装说明:TSOP1, TSSOP56,.8,20针数:56
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.82商用集成电路类型:CONSUMER CIRCUIT
JESD-30 代码:R-PDSO-G56JESD-609代码:e3
长度:18.4 mm功能数量:1
端子数量:56最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:TSOP1封装等效代码:TSSOP56,.8,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
电源:3.3 V认证状态:Not Qualified
座面最大高度:1.2 mm子类别:Audio Synthesizer ICs
最大压摆率:50 mA最大供电电压 (Vsup):3.3 V
最小供电电压 (Vsup):2.7 V表面贴装:YES
温度等级:INDUSTRIAL端子面层:MATTE TIN
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL宽度:14 mm

WTS701MF/T 数据手册

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PRELIMINARY  
WTS701  
WINBOND SINGLE-CHIP TEXT-TO-SPEECH PROCESSOR  
The information contained in this datasheet may be subject to change without  
notice. It is the responsibility of the customer to check the Winbond USA website  
(www.winbond-usa.com) periodically for the latest version of this document, and  
any Errata Sheets that may be generated between datasheet revisions.  
Publication Release Date May 2003  
- 1 -  
Revision 3.09  

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