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WTR06N180LS-CH PDF预览

WTR06N180LS-CH

更新时间: 2024-11-28 14:55:59
品牌 Logo 应用领域
先科 - SWST 晶体
页数 文件大小 规格书
7页 598K
描述
功率金氧半电晶体

WTR06N180LS-CH 数据手册

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WTR06N180LS-CH  
N-Channel Enhancement Mode MOSFET  
Features  
Drain  
• Low RDS(ON)  
• AEC-Q101 Qualified  
• Surface-mounted package  
• Low Gate-Source Threshold Voltage  
• Halogen and Antimony Free(HAF),  
RoHS compliant  
Gate  
Source  
1.Gate 2.Drain 3.Source  
TO-252 Plastic Package  
Key Parameters  
Parameter  
BVDSS  
Value  
60  
Unit  
V
18 @ VGS = 10 V  
20 @ VGS = 4.5 V  
1.5  
RDS(ON) Max  
mΩ  
VGS(th) typ  
Qg typ  
V
37 @ VGS = 10 V  
nC  
Absolute Maximum Ratings(at Ta = 25unless otherwise specified)  
Parameter  
Symbol  
Value  
60  
Unit  
V
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
VGS  
± 20  
V
Tc = 25℃  
Tc = 100℃  
38  
24  
ID  
Drain Current  
A
Peak Drain Current, Pulsed 1)  
Avalanche Current  
IDM  
IAS  
100  
20.3  
A
A
Single Pulse Avalanche Energy 2)  
Power Dissipation  
EAS  
20.6  
mJ  
W
Ptot  
48.4  
Tc = 25℃  
TJ, Tstg  
- 55 to + 150  
Operating Junction and Storage Temperature Range  
Thermal Characteristics  
Parameter  
Symbol  
RθJC  
Max.  
2.5  
Unit  
℃/W  
℃/W  
Thermal Resistance from Junction to Case  
Thermal Resistance from Junction to Ambient 3)  
RθJA  
37  
1) Pulse Test: Pulse Width 100 μs, Duty Cycle 2%, Repetitive rating, pulse width limited by junction temperature TJ(MAX) = 150.  
2) Limited by TJ(MAX), starting TJ = 25 , L = 0.1 mH, Rg = 25 Ω, IAS = 20.3 A, VGS = 10 V.  
3) Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate in still air.  
®
1 / 7  
Dated: 13/10/2022 Rev: 01  

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