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WTR02P130US PDF预览

WTR02P130US

更新时间: 2024-11-07 14:54:31
品牌 Logo 应用领域
先科 - SWST 晶体
页数 文件大小 规格书
8页 599K
描述
功率金氧半电晶体

WTR02P130US 数据手册

 浏览型号WTR02P130US的Datasheet PDF文件第2页浏览型号WTR02P130US的Datasheet PDF文件第3页浏览型号WTR02P130US的Datasheet PDF文件第4页浏览型号WTR02P130US的Datasheet PDF文件第5页浏览型号WTR02P130US的Datasheet PDF文件第6页浏览型号WTR02P130US的Datasheet PDF文件第7页 
WTR02P130US-HAF  
P-Channel Enhancement Mode MOSFET  
Drain  
Features  
• Low On-Resistance  
• Surface-mounted package  
Gate  
• Halogen and Antimony Free(HAF),  
RoHS compliant  
Source  
1.Gate 2.Drain 3.Source  
TO-252 Plastic Package  
Key Parameters  
Parameter  
-V(BR)DSS  
Value  
20  
Unit  
V
13 @ -VGS = 10 V  
17 @ -VGS = 4.5 V  
0.5  
RDS(ON) Max  
mΩ  
-VGS(th) typ  
Qg typ  
V
68 @ -VGS = 10 V  
nC  
Absolute Maximum Ratings (at Ta = 25unless otherwise specified)  
Parameter  
Symbol  
Value  
20  
Unit  
V
Drain-Source Voltage  
Gate-Source Voltage  
-VDS  
VGS  
± 12  
V
Tc = 25℃  
Tc = 100℃  
68  
43  
Drain Current  
-ID  
A
Peak Drain Current 1)  
Avalanche Current  
Avalanche Energy 2)  
Power Dissipation  
-IDM  
-IAS  
200  
A
A
30  
EAS  
45  
49  
mJ  
W
PD  
Tc = 25℃  
Operating Junction and Storage Temperature Range  
TJ,Tstg  
- 55 to + 150  
Thermal Characteristics  
Parameter  
Symbol  
RθJC  
Max.  
2.5  
Unit  
Thermal Resistance from Junction to Case  
/W  
/W  
Thermal Resistance from Junction to Ambient 3)  
1) Pulse Test: Pulse Width 100 μs, Duty Cycle 2%, Repetitive rating, pulse width limited by junction temperature TJ(MAX) = 150°C.  
2) Limited by TJ(MAX), starting TJ = 25 °C, L = 0.1 mH, Rg = 25 Ω, -ID = 30 A, VGS = 10 V.  
RθJA  
35  
3) Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate in still air.  
®
1 / 8  
Dated: 26/08/2021 Rev: 01  

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