WTR02P130US-HAF
P-Channel Enhancement Mode MOSFET
Drain
Features
• Low On-Resistance
• Surface-mounted package
Gate
• Halogen and Antimony Free(HAF),
RoHS compliant
Source
1.Gate 2.Drain 3.Source
TO-252 Plastic Package
Key Parameters
Parameter
-V(BR)DSS
Value
20
Unit
V
13 @ -VGS = 10 V
17 @ -VGS = 4.5 V
0.5
RDS(ON) Max
mΩ
-VGS(th) typ
Qg typ
V
68 @ -VGS = 10 V
nC
Absolute Maximum Ratings (at Ta = 25℃ unless otherwise specified)
Parameter
Symbol
Value
20
Unit
V
Drain-Source Voltage
Gate-Source Voltage
-VDS
VGS
± 12
V
Tc = 25℃
Tc = 100℃
68
43
Drain Current
-ID
A
Peak Drain Current 1)
Avalanche Current
Avalanche Energy 2)
Power Dissipation
-IDM
-IAS
200
A
A
30
EAS
45
49
mJ
W
℃
PD
Tc = 25℃
Operating Junction and Storage Temperature Range
TJ,Tstg
- 55 to + 150
Thermal Characteristics
Parameter
Symbol
RθJC
Max.
2.5
Unit
Thermal Resistance from Junction to Case
℃
℃
/W
/W
Thermal Resistance from Junction to Ambient 3)
1) Pulse Test: Pulse Width ≤ 100 μs, Duty Cycle ≤ 2%, Repetitive rating, pulse width limited by junction temperature TJ(MAX) = 150°C.
2) Limited by TJ(MAX), starting TJ = 25 °C, L = 0.1 mH, Rg = 25 Ω, -ID = 30 A, VGS = 10 V.
RθJA
35
3) Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate in still air.
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Dated: 26/08/2021 Rev: 01