WTM603C600LS-HAF
Complementary N/P-Channel Enhancement Mode MOSFET
Features
• Surface-mounted package
• Halogen and Antimony Free(HAF),
RoHS compliant
Q1:1.Source 2.Gate 7.Drain 8.Drain
Q2:3.Source 4.Gate 5.Drain 6.Drain
DFN5060 Plastic Package
Key Parameters(Q1)
Parameter
Key Parameters(Q2)
Value
30
Unit
V
Parameter
-V(BR)DSS
Value
30
Unit
V
V(BR)DSS
22 @ VGS = 10 V
32 @ VGS = 4.5 V
1.5
68 @ -VGS = 10 V
112 @ -VGS = 4.5 V
1.7
RDS(ON) Max
mΩ
RDS(ON) Max
mΩ
VGS(th) typ
Qg typ
V
-VGS(th) typ
Qg typ
V
12.7 @ VGS = 10 V
nC
8.1 @ -VGS = 10 V
nC
Absolute Maximum Ratings(at Ta = 25℃ unless otherwise specified)(Q1/Q2)
Value
Symbol
Unit
Parameter
Q1
30
Q2
- 30
± 20
VDS
VGS
V
V
Drain-Source Voltage
Gate-Source Voltage
± 20
Tc = 25℃
21
13
- 13
- 8
ID
A
Continuous Drain Current
Tc = 100℃
Peak Drain Current, Pulsed 1)
Avalanche Current
IDM
IAS
75
11.2
6.2
- 38
- 11.1
6.1
A
A
Single Pulse Avalanche Energy 2)
Power Dissipation
EAS
mJ
W
℃
PD
13
Tc = 25℃
TJ, Tstg
- 55 to + 150
Operating Junction and Storage Temperature Range
Thermal Characteristics(Q1/Q2)
Parameter
Symbol
Value
9.6
Unit
Thermal Resistance from Junction to Case
RθJC
RθJA
℃/W
℃/W
Thermal Resistance from Junction to Ambient 3)
65
1) Pulse Test: Pulse Width ≤ 100 μs, Duty Cycle ≤ 2%, Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C.
2) Limited by TJ(MAX), starting TJ = 25°C, L = 0.1 mH, Rg = 25 Ω, VGS = 10 V.
3) Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate in still air.
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Dated: 17/01/2022 Rev: 01