WTM603C290LS-HAF
Complementary N/P-Channel Enhancement Mode MOSFET
Features
• Low RDS( ON )
• Low Input Capacitance
• Halogen and Antimony Free(HAF),
RoHS compliant
Application
Q1:1.Source 2.Gate 7.Drain 8.Drain
• Motor/Body Load Control
• Load Switch
Q2:3.Source 4.Gate 5.Drain 6.Drain
DFN5060 Plastic Package
• DC-DC converters and Off-line UPS
Key Parameters(Q2)
Key Parameters(Q1)
Parameter
-BVDSS
Value
30
Unit
V
Parameter
BVDSS
Value
30
Unit
V
25 @ -VGS = 10 V
45 @ -VGS = 4.5 V
1.5
9.3 @ VGS = 10 V
13 @ VGS = 4.5 V
1.5
RDS(ON) Max
mΩ
RDS(ON) Max
mΩ
-VGS(th) typ
Qg typ
V
VGS(th) typ
Qg typ
V
19 @ -VGS = 10 V
nC
25 @ VGS = 10 V
nC
Absolute Maximum Ratings (at Ta = 25℃ unless otherwise specified)
Value
Symbol
Unit
Parameter
Q1
Q2
- 30
± 20
VDS
VGS
V
V
Drain-Source Voltage
30
Gate-Source Voltage
± 20
Tc = 25℃
40
25
- 24
- 15
ID
A
Continuous Drain Current
Tc = 100℃
Peak Drain Current, Pulsed 1)
Avalanche Current
170
19
- 70
- 20.8
21.7
IDM
IAS
A
A
Single Pulse Avalanche Energy 2)
Power Dissipation
18
EAS
mJ
W
℃
PD
19.7
Tc = 25℃
TJ, Tstg
- 55 to + 150
Operating Junction and Storage Temperature Range
Thermal Characteristics
Parameter
Symbol
Max.
6.3
Unit
Thermal Resistance from Junction to Case
Thermal Resistance from Junction to Ambient 3)
1) Pulse Test: Pulse Width ≤ 100 μs, Duty Cycle ≤ 2%, Repetitive rating, pulse width limited by junction temperature TJ(MAX) = 150°C.
2) Limited by TJ(MAX), starting TJ = 25 °C, L = 0.1 mH, Rg = 25 Ω, VGS = 10 V.
RθJC
℃
℃
/W
/W
RθJA
63
3) Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate in still air.
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Dated: 22/06/2022 Rev: 02