WTM506N180LS-HAF
N-Channel Enhancement Mode MOSFET
Drain
Features
• Low RDS(ON)
• Surface-mounted package
Gate
• Low Gate-Source Threshold Voltage
• Halogen and Antimony Free(HAF),
RoHS compliant
Source
1.Source 2.Source 3.Source 4.Gate
5.Drain 6.Drain 7.Drain 8.Drain
DFN5060 Plastic Package
Key Parameters
Parameter
BVDSS
Value
60
Unit
V
16 @ VGS = 10 V
18 @ VGS = 4.5 V
1.5
RDS(ON) Max
mΩ
VGS(th) typ
Qg typ
V
37 @ VGS = 10 V
nC
Absolute Maximum Ratings(at Ta = 25℃ unless otherwise specified)
Parameter
Symbol
VDS
Value
60
Unit
V
Drain-Source Voltage
Gate-Source Voltage
VGS
± 20
V
Tc = 25℃
33
23
Drain Current
ID
A
Tc = 100℃
Peak Drain Current, Pulsed 1)
Avalanche Current
IDM
IAS
100
20.3
A
A
Single Pulse Avalanche Energy 2)
EAS
20.6
mJ
W
℃
Power Dissipation
Ptot
37.5
Tc = 25℃
Operating Junction and Storage Temperature Range
TJ, Tstg
- 55 to + 175
Thermal Characteristics
Parameter
Symbol
RθJC
Max.
4
Unit
℃/W
℃/W
Thermal Resistance from Junction to Case
Thermal Resistance from Junction to Ambient 3)
RθJA
40
1) Pulse Test: Pulse Width ≤ 100 μs, Duty Cycle ≤ 2%, Repetitive rating, pulse width limited by junction temperature TJ(MAX) = 175℃.
2) Limited by TJ(MAX), starting TJ = 25 ℃, L = 0.1 mH, Rg = 25 Ω, IAS = 20.3 A, VGS = 10 V.
3) Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate in still air.
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Dated: 07/09/2023 Rev: 03