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WTM503P050L PDF预览

WTM503P050L

更新时间: 2024-11-21 14:55:35
品牌 Logo 应用领域
先科 - SWST 晶体
页数 文件大小 规格书
8页 1081K
描述
功率金氧半电晶体

WTM503P050L 数据手册

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WTM503P050L-HAF  
P-Channel Enhancement Mode MOSFET  
Features  
Drain  
• Low On-Resistance  
• Low Miller Charge  
• Halogen and Antimony Free(HAF),  
Gate  
RoHS compliant  
Source  
1.Source 2.Source 3.Source 4.Gate  
5.Drain 6.Drain 7.Drain 8.Drain  
DFN5060 Plastic Package  
Applications  
• Motor/Body Load Control  
• Load Switch  
Key Parameters  
Parameter  
-BVDSS  
Value  
30  
Unit  
V
5.2 @ -VGS = 10 V  
7.1 @ -VGS = 4.5 V  
1.3  
mΩ  
mΩ  
V
RDS(ON) Max  
-VGS(th) typ  
Qg typ  
124 @ -VGS = 10 V  
nC  
Absolute Maximum Ratings (at Ta = 25unless otherwise specified)  
Parameter  
Symbol  
Value  
30  
Unit  
V
Drain-Source Voltage  
Gate-Source Voltage  
-VDS  
VGS  
± 20  
70  
44  
V
Tc = 25°C  
Tc = 100°C  
Drain Current  
-ID  
A
Peak Drain Current, Pulsed 1)  
Avalanche Current  
-IDM  
-IAS  
EAS  
300  
36  
A
A
Single-Pulse Avalanche Energy 2)  
65  
mJ  
Tc = 25°C  
Ta = 25°C  
41  
3
Power Dissipation  
PD  
W
Operating Junction and Storage Temperature Range  
TJ, Tstg  
- 55 to + 150  
Thermal Characteristics  
Parameter  
Symbol  
RθJC  
Max.  
3
Unit  
Thermal Resistance from Junction to Case  
/W  
/W  
Thermal Resistance from Junction to Ambient 3)  
RθJA  
40  
1) Pulse Test: Pulse Width 100 μs, Duty Cycle 2%, Repetitive rating, pulse width limited by junction temperature TJ(MAX) = 150°C.  
2) Limited by TJ(MAX), starting TJ = 25, L = 0.1 mH, Rg = 25 Ω, ID = 36 A, VGS = 10 V.  
3) Device Surface Mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate, in a still air.  
®
1 / 8  
Dated: 28/10/2020 Rev: 01  

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