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WTM503N110L PDF预览

WTM503N110L

更新时间: 2024-11-21 14:56:03
品牌 Logo 应用领域
先科 - SWST 晶体
页数 文件大小 规格书
8页 497K
描述
功率金氧半电晶体

WTM503N110L 数据手册

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WTM503N110L-HAF  
N-Channel Enhancement Mode MOSFET  
Drain  
Features  
• Low On-Resistance  
• Low Gate Charge  
Gate  
• Halogen and Antimony Free(HAF),  
RoHS compliant  
Source  
1.Source 2.Source 3.Source 4.Gate  
5.Drain 6.Drain 7.Drain 8.Drain  
DFN5060 Plastic Package  
Application  
• Motor/Body Load Control  
• Load Switch  
• DC-DC converters and Off-line UPS  
Key Parameters  
Parameter  
BVDSS  
Value  
30  
Unit  
V
11 @ VGS = 10 V  
14.7 @ VGS = 4.5 V  
1.4  
RDS(ON) Max  
mΩ  
VGS(th) typ  
Qg typ  
V
20 @ VGS = 10 V  
nC  
Absolute Maximum Ratings (at Ta = 25unless otherwise specified)  
Symbol  
VDS  
Value  
30  
Unit  
V
Parameter  
Drain-Source Voltage  
Gate-Source Voltage  
VGS  
± 20  
V
Tc = 25℃  
Tc = 100℃  
40  
25  
ID  
A
Continuous drain current  
Peak Drain Current, Pulsed 1)  
Avalanche Current  
IDM  
IAS  
150  
21  
A
A
Single Pulse Avalanche Energy 2)  
Power Dissipation  
EAS  
22  
mJ  
W
Ptot  
28.6  
Tc = 25℃  
TJ, Tstg  
- 55 to + 150  
Operating Junction and Storage Temperature Range  
Thermal Characteristics  
Parameter  
Symbol  
RθJC  
Max.  
4.3  
Unit  
Thermal Resistance from Junction to Case  
Thermal Resistance from Junction to Ambient 3)  
1) Pulse Test: Pulse Width 100 μs, Duty Cycle 2%, Repetitive rating, pulse width limited by junction temperature TJ(MAX) = 150°C.  
2) Limited by TJ(MAX), starting TJ = 25 °C, L = 0.1 mH, Rg = 25 Ω, ID = 21 A, VGS = 10 V.  
/W  
/W  
RθJA  
40.5  
3) Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate in still air.  
®
1 / 8  
Dated: 13/01/2021 Rev: 01  

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