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WTM503N030LS-CH PDF预览

WTM503N030LS-CH

更新时间: 2024-11-06 14:52:35
品牌 Logo 应用领域
先科 - SWST 晶体
页数 文件大小 规格书
7页 665K
描述
功率金氧半电晶体

WTM503N030LS-CH 数据手册

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WTM503N030LS-CH  
N-Channel Enhancement Mode MOSFET  
Features  
Drain  
• AEC-Q101 Qualified  
• Low RDS( ON )  
• Low Miller Charge  
Gate  
• Halogen and Antimony Free(HAF),  
RoHS compliant  
Source  
1.Source 2.Source 3.Source 4.Gate  
5.Drain 6.Drain 7.Drain 8.Drain  
DFN5060 Plastic Package  
Application  
• Motor/Body Load Control  
• Load Switch  
• DC-DC converters and Off-line UPS  
Key Parameters  
Parameter  
BVDSS  
Value  
30  
Unit  
V
3.1 @ VGS = 10 V  
4.6 @ VGS = 4.5 V  
1.5  
RDS(ON) Max  
mΩ  
VGS(th) typ  
Qg typ  
V
79 @ VGS = 10 V  
nC  
Absolute Maximum Ratings (at Ta = 25unless otherwise specified)  
Parameter  
Symbol  
VDS  
Value  
30  
Unit  
V
Drain-Source Voltage  
Gate-Source Voltage  
VGS  
± 20  
V
Tc = 25℃  
Tc = 100℃  
68  
43  
Drain Current  
ID  
A
Peak Drain Current, Pulsed 1)  
Avalanche Current  
IDM  
IAS  
210  
40  
A
A
Single Pulse Avalanche Energy 2)  
EAS  
80  
mJ  
Tc = 25℃  
Tc = 100℃  
25  
10  
Power Dissipation  
PD  
W
Operating Junction and Storage Temperature Range  
TJ, Tstg  
- 55 to + 150  
Thermal Characteristics  
Parameter  
Symbol  
RθJC  
Max.  
5
Unit  
Thermal Resistance from Junction to Case  
/W  
/W  
Thermal Resistance from Junction to Ambient 3)  
1) Pulse Test: Pulse Width 100 μs, Duty Cycle 2%, Repetitive rating, pulse width limited by junction temperature TJ(MAX) = 150°C.  
2) Limited by TJ(MAX), starting TJ = 25 °C, L = 0.1 mH, Rg = 25 Ω, IAS = 40 A, VGS = 10 V.  
RθJA  
50  
3) Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate in still air.  
®
1 / 7  
Dated: 29/09/2022 Rev: 01  

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