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WSF512K32-27G2TIA PDF预览

WSF512K32-27G2TIA

更新时间: 2024-09-23 15:58:03
品牌 Logo 应用领域
WEDC 静态存储器内存集成电路
页数 文件大小 规格书
14页 317K
描述
Memory Circuit, Flash+SRAM, 512KX32, CMOS, CQFP68, 0.880 X 0.880 INCH, 0.180 INCH HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68

WSF512K32-27G2TIA 数据手册

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WSF512K32-XXX  
White Electronic Designs  
PRELIMINARY*  
512KX32 SRAM / FLASH MODULE  
Built in Decoupling Caps and Multiple Ground Pins  
for Low Noise Operation  
Weight - 13 grams typical  
FEATURES  
Access Times of 25ns (SRAM) and 70, 90ns  
(FLASH)  
Packaging  
FLASH MEMORY FEATURES  
• 66 pin, PGA Type, 1.385" square HIP, Hermetic  
Ceramic HIP (Package 402)  
100,000 Erase/Program Cycles  
Sector Architecture  
• 68 lead, Hermetic CQFP (G2T), 22.4mm (0.880")  
square (Package 509) 4.57mm (0.180") height.  
Designed to fit JEDEC 68 lead 0.990" CQFJ  
footprint (Figure 2). Package to be developed.  
• 8 equal size sectors of 64KBytes each  
• Any combination of sectors can be concurrently  
erased. Also supports full chip erase  
5 Volt Programming; 5V 10ꢀ Supply  
Embedded Erase and Program Algorithms  
Hardware Write Protection  
Page Program Operation and Internal Program  
Control Time.  
512Kx32 SRAM  
512Kx32 5V Flash  
Organized as 512Kx32 of SRAM and 512Kx32 of  
Flash Memory with common Data Bus  
Low Power CMOS  
Commercial, Industrial and Military Temperature  
Ranges  
TTL Compatible Inputs and Outputs  
* This product is under development, is not qualified or characterized and is subject to  
change without notice.  
Note: Programming information available upon request.  
Figure 1 – PIN CONFIGURATION FOR WSF512K32-29H2X  
Pin Description  
Top View  
I/O0-31  
Data Inputs/Outputs  
Address Inputs  
SRAM Write Enables  
SRAM Chip Select  
Output Enable  
1
12  
23  
34  
45  
56  
A0-18  
SWE1-4#  
SCS#  
OE#  
I/O8  
I/O9  
I/O10  
A14  
A16  
A11  
A0  
FWE2#  
SWE2#  
GND  
I/O11  
A10  
I/O15  
I/O14  
I/O13  
I/O12  
OE#  
I/O24  
I/O25  
I/O26  
A7  
VCC  
SWE4#  
FWE4#  
I/O27  
A4  
I/O31  
I/O30  
I/O29  
I/O28  
A1  
VCC  
GND  
NC  
Power Supply  
Ground  
Not Connected  
Flash Write Enables  
Flash Chip Select  
FWE1-4#  
FCS#  
A12  
A9  
A17  
SWE1#  
A13  
A5  
A2  
A15  
FWE1#  
I/O7  
A6  
A3  
Block Diagram  
FWE  
1
#
SWE  
1
#
FWE  
2
#
SWE  
2
#
FWE  
3
#
SWE  
3
#
FWE4# SWE4#  
A18  
I/O0  
I/O1  
I/O2  
VCC  
FCS#  
SCS#  
I/O3  
A8  
FWE3#  
SWE3#  
GND  
I/O23  
I/O22  
I/O21  
I/O20  
OE#  
A0-18  
SCS#  
FCS#  
I/O6  
I/O16  
I/O17  
I/O18  
I/O5  
512K x 8 Flash  
512K x 8 Flash  
512K x 8 Flash  
512K x 8 Flash  
512K x 8 SRAM  
512K x 8 SRAM  
512K x 8 SRAM  
512K x 8 SRAM  
I/O4  
I/O19  
11  
22  
33  
44  
55  
66  
I/O0-7  
I/O8-15  
I/O16-23  
I/O24-31  
May 2004  
Rev. 8  
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  

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