WS512K32-XXX
512Kx32 SRAM MODULE, SMD 5962-94611
FEATURES
Access Times of 15, 17, 20, 25, 35, 45, 55ns
TTL Compatible Inputs and Outputs
Packaging
5 Volt Power Supply
Low Power CMOS
• 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP
(Package 400).
Built-in Decoupling Caps and Multiple Ground Pins for Low
• 68 lead, 40mm Hermetic Low Profile CQFP, 3.5mm
(0.140") (Package 502)1
Noise Operation
Weight
• 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square
(Package 510) 3.56mm (0.140") height.
WS512K32N-XH1X - 13 grams typical
WS512K32-XG2UX - 8 grams typical
WS512K32-XG4TX1 - 20 grams typical
WS512K32-XG2LX - 8 grams typical
• 68 lead, Hermetic CQFP (G2L), 22.4mm (0.880") square,
5.08mm (0.200") high (Package 528).
Organized as 512Kx32, User Configurable as 1Mx16 or
2Mx8
* This product is subject to change without notice.
Note 1: Package Not Recommended For New Design
Commercial, Industrial and Military Temperature Ranges
FIGURE 1 – PIN CONFIGURATION FOR WS512K32N-XH1X
Top View
Pin Description
1
12
23
34
45
56
I/O0-31
A0-18
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
I/O8
I/O9
I/O10
A13
WE2#
CS2#
GND
I/O11
A10
I/O15
I/O24
I/O25
I/O26
A6
VCC
CS4#
WE4#
I/O27
A3
I/O31
I/O30
I/O29
I/O28
A0
WE1-4
#
I/O14
I/O13
I/O12
OE#
A18
CS1-4
OE#
VCC
#
Output Enable
Power Supply
Ground
GND
NC
Not Connected
A14
A7
A15
A11
NC
A4
A1
Block Diagram
A16
A12
WE1#
I/O7
A8
A5
A2
WE1# CS1#
512K X 8
WE2# CS2#
WE3# CS3#
WE4# CS4#
512K X 8
OE#
A0-18
A17
VCC
CS1#
NC
A9
WE3#
CS3
GND
I/O19
I/O23
I/O22
I/O21
I/O20
I/O0
I/O1
I/O2
I/O6
I/O16
I/O17
I/O18
512K X 8
512K X 8
I/O5
I/O3
I/O4
8
8
8
8
11
22
33
44
55
66
I/O0 - 7
I/O8 - 15
I/O16 - 23
I/O24 - 31
Microsemi Corporation reserves the right to change products or specifications without notice.
April 2016 © 2016 Microsemi Corporation. All rights reserved.
Rev. 22
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp