5秒后页面跳转
WS512K32-17G1TIA PDF预览

WS512K32-17G1TIA

更新时间: 2024-02-02 20:09:51
品牌 Logo 应用领域
WEDC 静态存储器内存集成电路
页数 文件大小 规格书
13页 485K
描述
SRAM Module, 512KX32, 17ns, CMOS, CQFP68, 23.90 X 23.90 MM, 4.06 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68

WS512K32-17G1TIA 技术参数

是否Rohs认证:不符合生命周期:Obsolete
包装说明:23.90 X 23.90 MM, 4.06 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68Reach Compliance Code:unknown
风险等级:5.28Is Samacsys:N
最长访问时间:17 ns其他特性:IT CAN ALSO BE CONFIGURED AS 2M X 8
备用内存宽度:16I/O 类型:COMMON
JESD-30 代码:S-CQFP-G68长度:23.88 mm
内存密度:16777216 bit内存集成电路类型:SRAM MODULE
内存宽度:32功能数量:1
端子数量:68字数:524288 words
字数代码:512000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:512KX32输出特性:3-STATE
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:QFP
封装等效代码:QFP68,.99SQ,50封装形状:SQUARE
封装形式:FLATPACK并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED电源:5 V
认证状态:Not Qualified座面最大高度:4.06 mm
最大待机电流:0.028 A最小待机电流:2 V
子类别:SRAMs最大压摆率:0.66 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:1.27 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:23.88 mmBase Number Matches:1

WS512K32-17G1TIA 数据手册

 浏览型号WS512K32-17G1TIA的Datasheet PDF文件第2页浏览型号WS512K32-17G1TIA的Datasheet PDF文件第3页浏览型号WS512K32-17G1TIA的Datasheet PDF文件第4页浏览型号WS512K32-17G1TIA的Datasheet PDF文件第5页浏览型号WS512K32-17G1TIA的Datasheet PDF文件第6页浏览型号WS512K32-17G1TIA的Datasheet PDF文件第7页 
WS512K32-XXX  
White Electronic Designs  
512Kx32 SRAM MODULE, SMD 5962-94611  
FEATURES  
n
Access Times of 15*, 17, 20, 25, 35, 45, 55ns  
n Organized as 512Kx32, User Configurable as  
1Mx16 or 2Mx8  
n
Packaging  
n Commercial, Industrial and Military Temperature  
•
66 pin, PGA Type, 1ꢀ075" square, Hermetic  
Ceramic HIP (Package 400)ꢀ  
Ranges  
n TTL Compatible Inputs and Outputs  
n 5 Volt Power Supply  
•
•
•
•
68 lead, 40mm Hermetic Low Profile CQFP,  
3ꢀ5mm (0ꢀ140") (Package 502)1  
68 lead, Hermetic CQFP (G2U), 22ꢀ4mm (0ꢀ880")  
square (Package 510) 3ꢀ56mm (0ꢀ140") heightꢀ  
n Low Power CMOS  
n
Built-in Decoupling Caps and Multiple Ground Pins  
for Low Noise Operation  
68 lead, Hermetic CQFP (G2L), 22ꢀ4mm (0ꢀ880")  
square, 5ꢀ08mm (0ꢀ200") high (Package 528)ꢀ  
68 lead, Hermetic CQFP (G1U)1, 23ꢀ9mm (0ꢀ940")  
square (Package 519) 3ꢀ57mm (0ꢀ140") heightꢀ  
Designed to fit JEDEC 68 lead 0ꢀ990" CQFJ  
footprint (Figꢀ 3)ꢀ  
n Weight  
WS512K32N-XH1X - 13 grams typical  
WS512K32-XG2UX - 8 grams typical  
WS512K32-XG1UX1 - 5 grams typical  
WS512K32-XG1TX - 5 grams typical  
WS512K32-XG4TX1 - 20 grams typical  
WS512K32-XG2LX - 8 grams typical  
•
68 lead, Hermetic CQFP (G1T), 23ꢀ9mm (0ꢀ940")  
square (Package 524) 4ꢀ06mm (0ꢀ160") heightꢀ  
*15ns Access Time available only in Commercial and Industrial  
Temperatureꢀ This speed is not fully characterized and is subject to  
change without noticeꢀ  
Note 1: Package Not Recommended For New Design  
FIGꢀ 1 PIN CONFIGURATION FOR WS512K32N-XH1X  
TOP VIEW  
PIN DESCRIPTION  
I/O0-31 Data Inputs/Outputs  
A0-18  
WE1-4  
CS1-4  
OE  
Address Inputs  
Write Enables  
Chip Selects  
Output Enable  
Power Supply  
Ground  
VCC  
GND  
NC  
Not Connected  
BLOCK DIAGRAM  
1
White Electronic Designs Corporation • (602) 437-1520 • wwwꢀwhiteedcꢀcom  
May2003, Rev12  

与WS512K32-17G1TIA相关器件

型号 品牌 描述 获取价格 数据表
WS512K32-17G1UIA WEDC SRAM Module, 512KX32, 17ns, CMOS, CQFP68, 23.90 X 23.90 MM, 3.57 MM HEIGHT, HERMETIC SEALE

获取价格

WS512K32-17G1UMA WEDC SRAM Module, 512KX32, 17ns, CMOS, CQFP68, 23.90 X 23.90 MM, 3.57 MM HEIGHT, HERMETIC SEALE

获取价格

WS512K32-17G1UQ WEDC SRAM Module, 512KX32, 17ns, CMOS, CQFP68, 23.90 X 23.90 MM, 3.57 MM HEIGHT, HERMETIC SEALE

获取价格

WS512K32-17G2CA WEDC SRAM Module, 2MX8, 17ns, CMOS, CQFP68,

获取价格

WS512K32-17G2I ETC x32 SRAM Module

获取价格

WS512K32-17G2LCA MERCURY SRAM Module, 512KX32, 17ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALE

获取价格