Datasheet > WS512K32-15G4TC

WS512K32-15G4TC

更新时间： 2023-01-15 00:00:00

品牌	Logo	应用领域
玛居礼 - MERCURY		静态存储器
页数	文件大小	规格书
11页	1213K
描述
SRAM Module, 512KX32, 15ns, CMOS, CQFP68, CERAMIC, QFP-68

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中文翻译

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数据手册

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WS512K32-15G4TC 数据手册

WS512K32-XXX

512Kx32 SRAM MODULE, SMD 5962-94611

FEATURES

 Access Times of 15, 17, 20, 25, 35, 45, 55ns

 TTL Compatible Inputs and Outputs

 Packaging

 5 Volt Power Supply

 Low Power CMOS

• 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP

(Package 400).

 Built-in Decoupling Caps and Multiple Ground Pins for Low

• 68 lead, 40mm Hermetic Low Proﬁle CQFP, 3.5mm

(0.140") (Package 502)¹

Noise Operation

 Weight

• 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square

(Package 510) 3.56mm (0.140") height.

 WS512K32N-XH1X - 13 grams typical

WS512K32-XG2UX - 8 grams typical

WS512K32-XG4TX¹- 20 grams typical

WS512K32-XG2LX - 8 grams typical

• 68 lead, Hermetic CQFP (G2L), 22.4mm (0.880") square,

5.08mm (0.200") high (Package 528).

 Organized as 512Kx32, User Conﬁgurable as 1Mx16 or

2Mx8

* This product is subject to change without notice.

Note 1: Package Not Recommended For New Design

 Commercial, Industrial and Military Temperature Ranges

FIGURE 1 – PIN CONFIGURATION FOR WS512K32N-XH1X

Top View

Pin Description

I/O_0-31

A_0-18

Data Inputs/Outputs

Address Inputs

Write Enables

Chip Selects

I/O₈

I/O₉

I/O₁₀

A₁₃

WE₂#

CS₂#

GND

I/O₁₁

A₁₀

I/O₁₅

I/O₂₄

I/O₂₅

I/O₂₆

A₆

V_CC

CS₄#

WE₄#

I/O₂₇

A₃

I/O₃₁

I/O₃₀

I/O₂₉

I/O₂₈

A₀

WE_1-4

I/O₁₄

I/O₁₃

I/O₁₂

OE#

A₁₈

CS_1-4

OE#

V_CC

Output Enable

Power Supply

Ground

GND

Not Connected

A₁₄

A₇

A₁₅

A₁₁

A₄

A₁

Block Diagram

A₁₆

A₁₂

WE₁#

I/O₇

A₈

A₅

A₂

WE₁# CS₁#

512K X 8

WE₂# CS₂#

WE₃# CS₃#

WE₄# CS₄#

512K X 8

OE#

A_0-18

A₁₇

V_CC

CS₁#

A₉

WE₃#

CS₃

GND

I/O₁₉

I/O₂₃

I/O₂₂

I/O₂₁

I/O₂₀

I/O₀

I/O₁

I/O₂

I/O₆

I/O₁₆

I/O₁₇

I/O₁₈

512K X 8

I/O₅

I/O₃

I/O₄

I/O_{0 - 7}

I/O_{8 - 15}

I/O_{16 - 23}

I/O_{24 - 31}

Microsemi Corporation reserves the right to change products or speciﬁcations without notice.

Rev. 22

Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp

12 3 4 5 6 7...11

中文翻译

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与WS512K32-15G4TC相关器件

型号	品牌	获取价格	描述	数据表
WS512K32-15G4TIA	MICROSEMI	获取价格	SRAM Module, 512KX32, 15ns, CMOS, CQFP68, 40 X 40 MM, 3.50 MM HEIGHT, HERMETIC SEALED, CER
WS512K32-15G4TM	MERCURY	获取价格	SRAM Module, 512KX32, 15ns, CMOS, CQFP68, 40 X 40 MM, 3.50 MM HEIGHT, HERMETIC SEALED, CER
WS512K32-15G4TQ	MICROSEMI	获取价格	SRAM Module, 512KX32, 15ns, CMOS, CQFP68, 40 X 40 MM, 3.50 MM HEIGHT, HERMETIC SEALED, CER
WS512K32-15G4TQA	MICROSEMI	获取价格	SRAM Module, 512KX32, 15ns, CMOS, CQFP68, 40 X 40 MM, 3.50 MM HEIGHT, HERMETIC SEALED, CER
WS512K32-15H1I	MICROSEMI	获取价格	SRAM Module, 512KX32, 15ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HI
WS512K32-15H1M	MICROSEMI	获取价格	SRAM Module, 512KX32, 15ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HI
WS512K32-15H1MA	MICROSEMI	获取价格	SRAM Module, 512KX32, 15ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HI
WS512K32-15NH1C	WEDC	获取价格	SRAM Module, 512KX32, 15ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HI
WS512K32-15NH1CA	WEDC	获取价格	SRAM Module, 512KX32, 15ns, CMOS, CERAMIC, HIP-66
WS512K32-15NH1IA	WEDC	获取价格	SRAM Module, 512KX32, 15ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HI

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