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WPR65N430K-CH PDF预览

WPR65N430K-CH

更新时间: 2024-11-07 14:52:43
品牌 Logo 应用领域
先科 - SWST 晶体
页数 文件大小 规格书
7页 578K
描述
功率金氧半电晶体

WPR65N430K-CH 数据手册

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WPR65N430K-CH  
N-Channel Enhancement Mode MOSFET  
Drain  
Features  
• AEC-Q101 Qualified  
• Surface-mounted package  
Gate  
• Halogen and Antimony Free(HAF),  
RoHS compliant  
• Built-in G-S Protection Diode  
• Typical ESD Protection HBM Class 2  
1.Gate 2.Drain 3.Source  
TO-252 Plastic Package  
Source  
Classification Voltage Range(V)  
0A  
0B  
1A  
1B  
1C  
2
< 125  
125 to < 250  
250 to < 500  
500 to < 1000  
1000 to < 2000  
2000 to < 4000  
4000 to < 8000  
8000  
Key Parameters  
Parameter  
BVDSS  
Value  
650  
Unit  
V
RDS(ON) Max  
VGS(th) typ  
Qg typ  
430 @ VGS = 10 V  
2.9  
mΩ  
V
3A  
3B  
18.4 @ VGS = 10 V  
nC  
Absolute Maximum Ratings(at Ta = 25unless otherwise specified)  
Parameter  
Symbol  
VDS  
Value  
650  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
V
V
VGS  
± 30  
Tc = 25℃  
Tc = 100℃  
6
3.8  
Drain Current  
ID  
A
Peak Drain Current, Pulsed 1)  
Avalanche Current  
IDM  
IAS  
25  
2.1  
A
A
Single Pulse Avalanche Energy 2)  
Power Dissipation  
EAS  
174  
mJ  
W
PD  
36  
Tc = 25℃  
Operating Junction and Storage Temperature Range  
TJ, Tstg  
- 55 to + 150  
Thermal Characteristics  
Parameter  
Symbol  
RθJC  
Max.  
3.4  
Unit  
Thermal Resistance from Junction to Case  
Thermal Resistance from Junction to Ambient 3)  
1) Pulse Test: Pulse Width 100 μs, Duty Cycle 2%, Repetitive rating, pulse width limited by junction temperature TJ(MAX) = 150°C.  
2) Limited by TJ(MAX), starting TJ = 25 °C, L = 79 mH, Rg = 25 Ω, IAS = 2.1 A, VGS = 10 V.  
/W  
/W  
RθJA  
50  
3) Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate in still air.  
1 / 7  
®
Dated: 30/05/2023 Rev: 01  

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