WPR65N430K-CH
N-Channel Enhancement Mode MOSFET
Drain
Features
• AEC-Q101 Qualified
• Surface-mounted package
Gate
• Halogen and Antimony Free(HAF),
RoHS compliant
• Built-in G-S Protection Diode
• Typical ESD Protection HBM Class 2
1.Gate 2.Drain 3.Source
TO-252 Plastic Package
Source
Classification Voltage Range(V)
0A
0B
1A
1B
1C
2
< 125
125 to < 250
250 to < 500
500 to < 1000
1000 to < 2000
2000 to < 4000
4000 to < 8000
≥ 8000
Key Parameters
Parameter
BVDSS
Value
650
Unit
V
RDS(ON) Max
VGS(th) typ
Qg typ
430 @ VGS = 10 V
2.9
mΩ
V
3A
3B
18.4 @ VGS = 10 V
nC
Absolute Maximum Ratings(at Ta = 25℃ unless otherwise specified)
Parameter
Symbol
VDS
Value
650
Unit
Drain-Source Voltage
Gate-Source Voltage
V
V
VGS
± 30
Tc = 25℃
Tc = 100℃
6
3.8
Drain Current
ID
A
Peak Drain Current, Pulsed 1)
Avalanche Current
IDM
IAS
25
2.1
A
A
Single Pulse Avalanche Energy 2)
Power Dissipation
EAS
174
mJ
W
℃
PD
36
Tc = 25℃
Operating Junction and Storage Temperature Range
TJ, Tstg
- 55 to + 150
Thermal Characteristics
Parameter
Symbol
RθJC
Max.
3.4
Unit
Thermal Resistance from Junction to Case
Thermal Resistance from Junction to Ambient 3)
1) Pulse Test: Pulse Width ≤ 100 μs, Duty Cycle ≤ 2%, Repetitive rating, pulse width limited by junction temperature TJ(MAX) = 150°C.
2) Limited by TJ(MAX), starting TJ = 25 °C, L = 79 mH, Rg = 25 Ω, IAS = 2.1 A, VGS = 10 V.
℃
℃
/W
/W
RθJA
50
3) Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate in still air.
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®
Dated: 30/05/2023 Rev: 01