生命周期: | Transferred | 零件包装代码: | DFP |
包装说明: | CERAMIC, FP-36 | 针数: | 36 |
Reach Compliance Code: | compliant | ECCN代码: | 3A001.A.2.C |
HTS代码: | 8542.32.00.41 | 风险等级: | 5.17 |
Is Samacsys: | N | 最长访问时间: | 85 ns |
JESD-30 代码: | R-CDFP-F36 | 长度: | 23.37 mm |
内存密度: | 4194304 bit | 内存集成电路类型: | STANDARD SRAM |
内存宽度: | 8 | 功能数量: | 1 |
端子数量: | 36 | 字数: | 524288 words |
字数代码: | 512000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
组织: | 512KX8 | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | DFP | 封装形状: | RECTANGULAR |
封装形式: | FLATPACK | 并行/串行: | PARALLEL |
认证状态: | Not Qualified | 座面最大高度: | 3.18 mm |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 4.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | MILITARY |
端子形式: | FLAT | 端子节距: | 1.27 mm |
端子位置: | DUAL | 宽度: | 12.95 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
WMS512K8-85FQ | MICROSEMI |
获取价格 |
Standard SRAM, 512KX8, 85ns, CMOS, CDFP36, CERAMIC, FP-36 | |
WMS512K8B-15CIE | WEDC |
获取价格 |
Standard SRAM, 512KX8, 15ns, CDIP32, | |
WMS512K8B-15DEIE | WEDC |
获取价格 |
Standard SRAM, 512KX8, 15ns, CDSO32, | |
WMS512K8B-15FCE | WEDC |
获取价格 |
Standard SRAM, 512KX8, 15ns, CDFP36, | |
WMS512K8B-15FEIE | WEDC |
获取价格 |
Standard SRAM, 512KX8, 15ns, CDFP32, | |
WMS512K8B-17CCE | WEDC |
获取价格 |
Standard SRAM, 512KX8, 17ns, CDIP32, | |
WMS512K8B-17CME | WEDC |
获取价格 |
Standard SRAM, 512KX8, 17ns, CDIP32, | |
WMS512K8B-17DEME | WEDC |
获取价格 |
Standard SRAM, 512KX8, 17ns, CDSO32, | |
WMS512K8B-17DJIE | WEDC |
获取价格 |
Standard SRAM, 512KX8, 17ns, CDSO36, | |
WMS512K8B-17DJME | WEDC |
获取价格 |
Standard SRAM, 512KX8, 17ns, CDSO36, |