WM9093
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Ultra Low Power Audio Subsystem
DESCRIPTION
FEATURES
The WM9093[1] is a high performance low power audio
subsystem, including headphone driver and Class AB/D
Mono Class D speaker driver
2W at 5V SVDD @1%THD+N into 4Ω
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650mW at 3.6V SVDD @1%THD+N into 8Ω
92dB SNR
Ground referenced stereo headphone driver
34mW into 16ꢀ load @ 1% THD+N
96dB SNR
80dB THD+N
Mono Class AB earpiece driver
40mW into 8ꢀ load
Differential and single ended analogue input configurations
Integrated oscillator for clocking requirements
I2C 2-wire software control interface
Automatic gain control (AGC) for Class D speaker output
Pop and click suppression, < 1mV DC offset
<50ms start up time
Excellent RF and TDMA noise immunity
Ultra low power consumption
4mW quiescent for headphone driver
5mW quiescent for speaker driver (Class D)
Shutdown current < 1uA
earpiece/speaker driver. The Class
D speaker driver
supports 650mW output power at 3.6V, 1%THD.
The unique dual mode charge pump architecture provides
ground referenced headphone outputs removing the
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requirement for external coupling capacitors. Class
G
technology is integrated to increase the efficiency and
extend playback time by optimizing the headphone driver
supply voltages according to the volume control.
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The flexible input configuration allows single ended or
differential stereo inputs. Mixers allow highly flexible routing
to the outputs. A ‘Voice Bypass’ path is also available for
low-power voice applications.
The WM9093 is controlled using a two-wire I2C interface.
An integrated oscillator generates all internal clocks,
removing the need to provide any external clock.
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Separate mixer and volume controls are provided for each
headphone and speaker driver. Automatic Gain Control
limits the speaker output signal in order to prevent clipping.
Supply voltage
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SVDD = 2.7V to 5.5V
HPVDD = 1.8V
1.8V to 2.7V control interface compatibility
20-bump CSP package
DC offset correction to less than 1mV guarantees
pop/click-free headphone start up.
a
The WM9093 is available in a 2.0mm x 2.5mm 20-bump
CSP package.
APPLICATIONS
Mobile handsets
BLOCK DIAGRAM
Production Data, March 2012, Rev 4.2
WOLFSON MICROELECTRONICS plc
[1] This product is protected by US Patents 7,622,984 and 7,626,445
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Copyright 2012 Wolfson Microelectronics plc