Datasheet > WFY3P02

WFY3P02

更新时间： 2024-09-24 07:06:15

品牌	Logo	应用领域
稳先微 - WINSEMI		/
页数	文件大小	规格书
5页	248K
描述
−20V, P−Channel MOSFET

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WFY3P02 数据手册

WFY3P02

−20V, P−Channel MOSFET

Features

■ -3.2A, -20V, R_DS(on)(Max 130mΩ)@V_GS=-4.5V

■ −1.8 V Rated for Low Voltage Gate Drive

■ SOT-23 Surface Mount for Small Footprint

■ Single Pulse Avalanche Energy Rated

General Description

This Power MOSFET is produced using Winsemi’s advanced

MOS technology. This latest technology has been especially

designed to minimize on-state resistance, have a high rugged

avalanche characteristics. This devices is specially well suited for

Load/Power Management for Portables and Computing,

Charging Circuits and Battery Protection

SOT-23

Marking: H03F

Absolute Maximum Ratings

Symbol

Parameter

Value

Units

V_DSS

Drain Source Voltage

-20

Tc=25℃

−2.8

Steady State

I_D

Continuous Drain Current(Note 1)

Tc=85℃

Tc=25℃

-1.7

t≤10s

Steady State

t≤10s

-3.2

0.80

1.25

-1.8

-1.3

0.42

P_D

I_D

Total Power Dissipation(Note 1)

Continuous Drain Current(Note 2)

Tc=25℃

Tc=85℃

Tc=25℃

Steady State

t=10s

P_D

Total Power Dissipation(Note 2)

Drain Current Pulsed

I_DM

-7.5

±8

V_GS

Gate to Source Voltage

ESD

ESD Capability (Note 3)

C=100pF,R_S= 1500Ω

225

T_J,T_stg

T_L

Junction and Storage Temperature

-55~150

260

℃

Maximum lead Temperature for soldering purposes

Maximum ratings are those values beyond which device damage can occur.Maximum ratings applied to the device are

individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded,

device functional operation is not implied, damage may occur and reliability may be affected.

Thermal Characteristics

Value

Typ

Symbol

Parameter

Units

Min

Max

170

110

R_QJA

Thermal Resistance, Junction-to-Ambient(Note 1)

Thermal Resistance, Junction-to-Ambient(Note 2)

℃/W

300

Note 1: Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [1 oz] including traces)

Note 2: Surface−mounted on FR4 board using the minimum recommended pad size.

Note 3: ESD Rating Information: HBM Class 0

Rev. A Mar.2010-H03F

P03-3

12 3 4 5

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