WFU730
Silicon N-Channel MOSFET
Features
■5.5A,400V, RDS(on)(Max 1.0Ω)@VGS=10V
■ Ultra-low Gate Charge(Typical 32nC)
■ Fast Switching Capability
■ 100%Avalanche Tested
■ Maximum Junction Temperature Range(150℃)
General Description
This Power MOSFET is produced using Winsemi’s advanced
planar stripe, DMOS technology. This latest technology has been
especially designed to minimize on-state resistance, have a high
rugged avalanche characteristics. This devices is specially well
suited for high efficiency switch model power supplies, power factor
correction and half bridge and full bridge resonant topology line a
electronic lamp ballast.
IPAK
Absolute Maximum Ratings
Symbol
Parameter
Value
400
5.5
Units
V
VDSS
Drain Source Voltage
Continuous Drain Current(@Tc=25℃)
Continuous Drain Current(@Tc=100℃)
Drain Current Pulsed
A
ID
2.9
A
IDM
VGS
EAS
(Note1)
22
A
Gate to Source Voltage
±30
330
7.4
V
Single Pulsed Avalanche Energy
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
(Note 2)
(Note 1)
(Note 3)
mJ
mJ
V/ns
W
EAR
dv/dt
4
Total Power Dissipation(@Tc=25℃)
Derating Factor above 25℃
Junction and Storage Temperature
Channel Temperature
48
PD
0.38
-55~150
300
W/℃
℃
TJ, Tstg
TL
℃
Thermal Characteristics
Value
Symbol
Parameter
Units
Min
Typ
Max
2.6
RQJC
RQJA
RQJA
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient*
Thermal Resistance, Junction-to-Ambient
-
-
-
-
-
-
℃/W
℃/W
℃/W
50
110
*When mounted on the minimum pad size recommended(PCB Mount)
Rev.A Nov.2010
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