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WF4M32-150G2TM5 PDF预览

WF4M32-150G2TM5

更新时间: 2024-11-05 20:14:11
品牌 Logo 应用领域
玛居礼 - MERCURY /
页数 文件大小 规格书
16页 1262K
描述
Flash Module, 4MX32, 150ns, CQFP68, 22.40 X 22.40 MM, 4.57 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68

WF4M32-150G2TM5 技术参数

生命周期:Contact Manufacturer包装说明:QFP-68
Reach Compliance Code:unknownECCN代码:3A001.A.2.C
HTS代码:8542.32.00.51风险等级:5.72
Is Samacsys:NBase Number Matches:1

WF4M32-150G2TM5 数据手册

 浏览型号WF4M32-150G2TM5的Datasheet PDF文件第2页浏览型号WF4M32-150G2TM5的Datasheet PDF文件第3页浏览型号WF4M32-150G2TM5的Datasheet PDF文件第4页浏览型号WF4M32-150G2TM5的Datasheet PDF文件第5页浏览型号WF4M32-150G2TM5的Datasheet PDF文件第6页浏览型号WF4M32-150G2TM5的Datasheet PDF文件第7页 
WF4M32-XXX5  
4Mx32 5V NOR FLASH MODULE  
FEATURES  
 Access Times of 100, 120, 150ns  
 5 Volt Read and Write. 5V ± 10% Supply.  
 Packaging:  
 Low Power CMOS  
• 66 pin, PGA Type, 1.385" square, Hermetic Ceramic HIP  
(Package 402).  
 Data# Polling and Toggle Bit feature for detection of  
program or erase cycle completion.  
• 68 lead, Hermetic CQFP (G2T), 22.4mm (0.880") square  
(Package 509) 4.57mm (0.180") height. Designed to t  
JEDEC 68 lead 0.990CQFJ footprint (Fig. 3)  
 Supports reading or programming data to a sector not being  
erased.  
 RESET# pin resets internal state machine to the read  
 Sector Architecture  
mode.  
• 32 equal size sectors of 64KBytes per each 2Mx8 chip  
 Built-in Decoupling Caps and Multiple Ground Pins for Low  
Noise Operation, Separate Power and Ground Planes to  
improve noise immunity  
• Any combination of sectors can be erased. Also supports  
full chip erase.  
 Minimum 100,000 Write/Erase Cycles Minimum  
 Organized as 4Mx32  
* This product is subject to change without notice.  
Note: For programming information refer to Flash Programming 16M5 Application Note.  
 User congurable as 2x4Mx16 or 4x4Mx8 in HIP.  
 Commercial, Industrial, and Military Temperature Ranges  
FIGURE 1 – PIN CONFIGURATION FOR  
WF4M32-XH2X5  
PIN DESCRIPTION  
I/O0-31  
A0-21  
Data Inputs/Outputs  
Address Inputs  
Write Enable  
Chip Select  
Output Enable  
Power Supply  
Ground  
Top View  
WE#  
1
12  
23  
34  
45  
56  
CS1-4  
#
OE#  
VCC  
I/O8  
I/O9  
I/O10  
A14  
A16  
A11  
A0  
RESET#  
CS2#  
GND  
I/O11  
A10  
I/O15  
I/O14  
I/O13  
I/O12  
OE#  
A17  
I/O24  
I/O25  
I/O26  
A7  
VCC  
CS4#  
NC  
I/O31  
I/O30  
I/O29  
I/O28  
A1  
VSS  
RESET#  
Reset  
I/O27  
A4  
A12  
BLOCK DIAGRAM  
A9  
A21  
A5  
A2  
CS1#  
CS2#  
CS3#  
CS4#  
A21  
A15  
WE#  
I/O7  
A13  
A6  
A3  
A18  
I/O0  
I/O1  
I/O2  
VCC  
A8  
A20  
CS3#  
GND  
I/O19  
I/O23  
I/O22  
I/O21  
I/O20  
OE#  
WE#  
CS1#  
A19  
I/O6  
I/O16  
I/O17  
I/O18  
A0-20  
RESET#  
2M x 8  
2M x 8  
2Mx 8  
2M x 8  
I/O5  
2M x 8  
2M x 8  
2M x 8  
2M x 8  
I/O3  
I/O4  
11  
22  
33  
44  
55  
66  
I/O16-23  
I/O24-31  
I/O0-7  
I/O8-15  
Microsemi Corporation reserves the right to change products or specications without notice.  
August 2011 © 2011 Microsemi Corporation. All rights reserved.  
Rev. 9  
1
Microsemi Corporation • (602) 437-1520 • www.whiteedc.com  
www.microsemi.com  

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