生命周期: | Transferred | 包装说明: | CERAMIC, LQFP-68 |
Reach Compliance Code: | unknown | 风险等级: | 5.73 |
最长访问时间: | 90 ns | 其他特性: | USER CONFIGURABLE AS 4M X 8 |
备用内存宽度: | 16 | 启动块: | BOTTOM |
JESD-30 代码: | S-CQFP-G68 | 内存密度: | 33554432 bit |
内存集成电路类型: | FLASH MODULE | 内存宽度: | 32 |
功能数量: | 1 | 端子数量: | 68 |
字数: | 1048576 words | 字数代码: | 1000000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 1MX32 | |
封装主体材料: | CERAMIC, METAL-SEALED COFIRED | 封装形状: | SQUARE |
封装形式: | FLATPACK | 并行/串行: | PARALLEL |
编程电压: | 5 V | 认证状态: | Not Qualified |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 4.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子形式: | GULL WING | 端子位置: | QUAD |
类型: | NOR TYPE | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
WEDF1M32B-70G2TC5A | WEDC |
获取价格 |
Flash Module, 1MX32, 70ns, CQFP68, 4.60 MM HEIGHT, CERAMIC, QFP-68 | |
WEDF1M32B-70G2TI5A | WEDC |
获取价格 |
Flash Module, 1MX32, 70ns, CQFP68, 4.60 MM HEIGHT, CERAMIC, QFP-68 | |
WEDF1M32B-70G2TM5 | WEDC |
获取价格 |
Flash Module, 1MX32, 70ns, CQFP68, 4.60 MM HEIGHT, CERAMIC, QFP-68 | |
WEDF1M32B-70G2TM5A | WEDC |
获取价格 |
Flash Module, 1MX32, 70ns, CQFP68, 4.60 MM HEIGHT, CERAMIC, QFP-68 | |
WEDF1M32B-70G2UC5A | MICROSEMI |
获取价格 |
Flash Module, 1MX32, 70ns, CQFP68, 0.140 X 0.140 INCH, 3.50 MM HEIGHT, CERAMIC, QFP-68 | |
WEDF1M32B-70G2UC5A | WEDC |
获取价格 |
Flash Module, 1MX32, 70ns, CQFP68, 0.140 X 0.140 INCH, 3.50 MM HEIGHT, CERAMIC, QFP-68 | |
WEDF1M32B-70G2UI5A | MERCURY |
获取价格 |
Flash Module, | |
WEDF1M32B-70H1C5A | MERCURY |
获取价格 |
Flash Module, | |
WEDF1M32B-70H1C5A | WEDC |
获取价格 |
Flash Module, 1MX32, 70ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | |
WEDF1M32B-70H1I5A | WEDC |
获取价格 |
Flash Module, 1MX32, 70ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |