5秒后页面跳转
WBCB0202AA011002KC PDF预览

WBCB0202AA011002KC

更新时间: 2024-11-21 00:11:39
品牌 Logo 应用领域
TTELEC /
页数 文件大小 规格书
3页 359K
描述
Wire Bondable Chip Resistors

WBCB0202AA011002KC 数据手册

 浏览型号WBCB0202AA011002KC的Datasheet PDF文件第2页浏览型号WBCB0202AA011002KC的Datasheet PDF文件第3页 
Resistors  
Wire Bondable  
Chip Resistors  
WBC Series  
ꢀ Discreteꢀorꢀtappedꢀschemaꢁcs  
ꢀ MILꢀinspecꢁonꢀavailable  
High resistor density  
AllꢀpartsꢀareꢀPb-freeꢀandꢀcomplyꢀwithꢀEUꢀDirecꢁveꢀ2011/65/EUꢀ(RoHS2)  
The WBC combines IRC’s TaNSil® tantalum nitride thin film technology with silicon substrate processing to  
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce  
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil®  
resistor film.  
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-  
tions. Custom resistance values, sizes and schematics are available on request from the factory.  
Electrical Data  
Physical Data  
R0202 - Discrete  
Absolute Tolerance  
to ±±.ꢀ1  
to ±ꢁ2ppmꢂ/C  
ꢁ2±mW  
Absolute TCR  
R
Package Power Rating  
(@ 70°C)  
0.004˝ min bond pad size  
0.020˝ 0.001  
Rated Operating Voltage  
(0.508mm 0.025)  
ꢀ±±V  
-22/C to +ꢀ2±/C  
<-3±dB  
(not to exceed P x R )  
B0202 - Discrete back contact1  
Operating Temperature  
Noise  
Back contact  
R
Oxidized Silicon  
(ꢀ±KÅ SiOmin)  
Top contact  
pad chamfered  
Substrate Material  
Top contact  
0.004˝ min bond pad size  
0.020˝ 0.001  
±.±ꢀ±˝ ±±.±±ꢀ  
(±.ꢁ24mm ±±.±ꢁ2)  
(0.508mm 0.025)  
Substrate Thickness  
T0303 - Tapped network ½R + ½R  
Aluminum  
ꢀ±KÅ minimum  
ꢀ2KÅ minimum  
Bond Pad  
Metallization  
Gold1  
R±ꢁ±ꢁ and  
Silicon  
½R  
½R  
T±3±3  
(Al ꢂ Au optional)  
Backside  
3KÅ Au minimum  
ꢀ±KÅ Al minimum  
B±ꢁ±ꢁꢀ  
0.030˝ 0.001  
Silicon Dioxide or  
Silicon Nitride  
0.004˝ min bond pad size  
Passivation  
(0.762mm 0.025)  
Note 1: Not recommended for new designs  
General Note  
BI Technologies IRC Welwyn  
TT Electronics reserves the right to make changes in product specification without notice or liability.  
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.  
http://www.ttelectronics.com/resistors  
© TT Electronics plc  
05.17  

与WBCB0202AA011002KC相关器件

型号 品牌 获取价格 描述 数据表
WBCB0202AA011002KD TTELEC

获取价格

Wire Bondable Chip Resistors
WBCB0202AA011002KF TTELEC

获取价格

Wire Bondable Chip Resistors
WBCB0202AA011002KG TTELEC

获取价格

Wire Bondable Chip Resistors
WBCB0202AA011002KJ TTELEC

获取价格

Wire Bondable Chip Resistors
WBCB0202AA0150R1BA TTELEC

获取价格

Wire Bondable Chip Resistors
WBCB0202AA0150R1BB TTELEC

获取价格

Wire Bondable Chip Resistors
WBCB0202AA0150R1BC TTELEC

获取价格

Wire Bondable Chip Resistors
WBCB0202AA0150R1BD TTELEC

获取价格

Wire Bondable Chip Resistors
WBCB0202AA0150R1BF TTELEC

获取价格

Wire Bondable Chip Resistors
WBCB0202AA0150R1BG TTELEC

获取价格

Wire Bondable Chip Resistors