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W9425G8DH-75 PDF预览

W9425G8DH-75

更新时间: 2024-11-05 15:57:55
品牌 Logo 应用领域
华邦 - WINBOND 时钟动态存储器双倍数据速率光电二极管内存集成电路
页数 文件大小 规格书
53页 1920K
描述
DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66

W9425G8DH-75 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TSOP2包装说明:TSSOP, TSSOP66,.46
针数:66Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.32.00.24
风险等级:5.84访问模式:FOUR BANK PAGE BURST
最长访问时间:0.75 ns其他特性:AUTO/SELF REFRESH
最大时钟频率 (fCLK):133 MHzI/O 类型:COMMON
交错的突发长度:2,4,8JESD-30 代码:R-PDSO-G66
长度:22.22 mm内存密度:268435456 bit
内存集成电路类型:DDR DRAM内存宽度:8
功能数量:1端口数量:1
端子数量:66字数:33554432 words
字数代码:32000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:32MX8输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP66,.46封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH峰值回流温度(摄氏度):NOT SPECIFIED
电源:2.5 V认证状态:Not Qualified
刷新周期:8192座面最大高度:1.2 mm
自我刷新:YES连续突发长度:2,4,8
最大待机电流:0.02 A子类别:DRAMs
最大压摆率:0.3 mA最大供电电压 (Vsup):2.7 V
最小供电电压 (Vsup):2.3 V标称供电电压 (Vsup):2.5 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:10.16 mm
Base Number Matches:1

W9425G8DH-75 数据手册

 浏览型号W9425G8DH-75的Datasheet PDF文件第2页浏览型号W9425G8DH-75的Datasheet PDF文件第3页浏览型号W9425G8DH-75的Datasheet PDF文件第4页浏览型号W9425G8DH-75的Datasheet PDF文件第5页浏览型号W9425G8DH-75的Datasheet PDF文件第6页浏览型号W9425G8DH-75的Datasheet PDF文件第7页 
W9425G8DH  
8M × 4 BANKS × 8 BITS DDR SDRAM  
Table of Contents-  
1. GENERAL DESCRIPTION.............................................................................................................. 4  
2. FEATURES...................................................................................................................................... 4  
3. KEY PARAMETERS........................................................................................................................ 5  
4. PIN CONFIGURATION.................................................................................................................... 6  
5. PIN DESCRIPTION ......................................................................................................................... 7  
6. BLOCK DIAGRAM........................................................................................................................... 8  
7. FUNCTIONAL DESCRIPTION........................................................................................................ 9  
7.1 Power Up Sequence.............................................................................................................. 9  
7.2 Command Function ............................................................................................................... 9  
7.2.1  
7.2.2  
7.2.3  
7.2.4  
7.2.5  
7.2.6  
7.2.7  
7.2.8  
7.2.9  
Bank Activate Command........................................................................................................9  
Bank Precharge Command ....................................................................................................9  
Precharge All Command ........................................................................................................9  
Write Command .....................................................................................................................9  
Write with Auto-precharge Command ..................................................................................10  
Read Command ...................................................................................................................10  
Read with Auto-precharge Command ..................................................................................10  
Mode Register Set Command ..............................................................................................10  
Extended Mode Register Set Command ..............................................................................10  
7.2.10 No-Operation Command ......................................................................................................10  
7.2.11 Burst Read Stop Command..................................................................................................11  
7.2.12 Device Deselect Command..................................................................................................11  
7.2.13 Auto Refresh Command.......................................................................................................11  
7.2.14 Self Refresh Entry Command...............................................................................................11  
7.2.15 Self Refresh Exit Command .................................................................................................11  
7.2.16 Data Write Enable /Disable Command.................................................................................12  
7.3 Read Operation ................................................................................................................... 12  
7.4 Write Operation ................................................................................................................... 12  
7.5 Precharge............................................................................................................................ 12  
7.6 Burst Termination ................................................................................................................ 13  
7.7 Refresh Operation ............................................................................................................... 13  
7.8 Power Down Mode .............................................................................................................. 13  
7.9 Input Clock Frequency Change during Precharge Power Down Mode .............................. 13  
7.10 Mode Register Operation .................................................................................................... 14  
7.10.1 Burst Length field (A2 to A0) ................................................................................................14  
Publication Release Date: Nov. 20, 2007  
- 1 -  
Revision A4  

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