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W9425G6EH-5 PDF预览

W9425G6EH-5

更新时间: 2024-02-19 01:43:52
品牌 Logo 应用领域
华邦 - WINBOND 时钟动态存储器双倍数据速率光电二极管内存集成电路
页数 文件大小 规格书
54页 2017K
描述
DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 INCH, ROHS COMPLIANT, TSOP2-66

W9425G6EH-5 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TSOP2包装说明:TSOP2, TSSOP66,.46
针数:66Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.24
风险等级:5.15访问模式:FOUR BANK PAGE BURST
最长访问时间:0.7 ns其他特性:AUTO/SELF REFRESH
最大时钟频率 (fCLK):200 MHzI/O 类型:COMMON
交错的突发长度:2,4,8JESD-30 代码:R-PDSO-G66
长度:22.22 mm内存密度:268435456 bit
内存集成电路类型:DDR DRAM内存宽度:16
功能数量:1端口数量:1
端子数量:66字数:16777216 words
字数代码:16000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:16MX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSOP2
封装等效代码:TSSOP66,.46封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE峰值回流温度(摄氏度):NOT SPECIFIED
电源:2.5 V认证状态:Not Qualified
刷新周期:8192座面最大高度:1.2 mm
自我刷新:YES连续突发长度:2,4,8
最大待机电流:0.02 A子类别:DRAMs
最大压摆率:0.3 mA最大供电电压 (Vsup):2.7 V
最小供电电压 (Vsup):2.3 V标称供电电压 (Vsup):2.5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:10.16 mm
Base Number Matches:1

W9425G6EH-5 数据手册

 浏览型号W9425G6EH-5的Datasheet PDF文件第2页浏览型号W9425G6EH-5的Datasheet PDF文件第3页浏览型号W9425G6EH-5的Datasheet PDF文件第4页浏览型号W9425G6EH-5的Datasheet PDF文件第5页浏览型号W9425G6EH-5的Datasheet PDF文件第6页浏览型号W9425G6EH-5的Datasheet PDF文件第7页 
W9425G6EH  
4 M × 4 BANKS × 16 BITS DDR SDRAM  
Table of Contents-  
1.  
2.  
3.  
4.  
5.  
6.  
7.  
GENERAL DESCRIPTION.............................................................................................................................4  
FEATURES....................................................................................................................................................4  
KEY PARAMETERS ......................................................................................................................................5  
PIN CONFIGURATION ..................................................................................................................................6  
PIN DESCRIPTION........................................................................................................................................7  
BLOCK DIAGRAM .........................................................................................................................................8  
FUNCTIONAL DESCRIPTION.......................................................................................................................9  
7.1  
7.2  
Power Up Sequence ..........................................................................................................................9  
Command Function..........................................................................................................................10  
7.2.1 Bank Activate Command......................................................................................................10  
7.2.2 Bank Precharge Command ..................................................................................................10  
7.2.3 Precharge All Command ......................................................................................................10  
7.2.4 Write Command ...................................................................................................................10  
7.2.5 Write with Auto-precharge Command...................................................................................10  
7.2.6 Read Command ...................................................................................................................10  
7.2.7 Read with Auto-precharge Command ..................................................................................10  
7.2.8 Mode Register Set Command ..............................................................................................11  
7.2.9 Extended Mode Register Set Command ..............................................................................11  
7.2.10 No-Operation Command ......................................................................................................11  
7.2.11 Burst Read Stop Command..................................................................................................11  
7.2.12 Device Deselect Command..................................................................................................11  
7.2.13 Auto Refresh Command.......................................................................................................11  
7.2.14 Self Refresh Entry Command...............................................................................................12  
7.2.15 Self Refresh Exit Command .................................................................................................12  
7.2.16 Data Write Enable /Disable Command.................................................................................12  
7.3  
7.4  
7.5  
7.6  
7.7  
7.8  
7.9  
Read Operation................................................................................................................................12  
Write Operation ................................................................................................................................13  
Precharge.........................................................................................................................................13  
Burst Termination.............................................................................................................................13  
Refresh Operation............................................................................................................................13  
Power Down Mode...........................................................................................................................14  
Input Clock Frequency Change during Precharge Power Down Mode ............................................14  
7.10 Mode Register Operation .................................................................................................................14  
7.10.1 Burst Length field (A2 to A0) ................................................................................................14  
7.10.2 Addressing Mode Select (A3)...............................................................................................15  
Publication Release Date:Dec. 03, 2008  
- 1 -  
Revision A08  

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