5秒后页面跳转
W78M32VP-100BI PDF预览

W78M32VP-100BI

更新时间: 2024-09-17 03:36:47
品牌 Logo 应用领域
玛居礼 - MERCURY 内存集成电路
页数 文件大小 规格书
47页 1902K
描述
Flash

W78M32VP-100BI 技术参数

生命周期:Active包装说明:,
Reach Compliance Code:compliant风险等级:5.69
内存集成电路类型:FLASH编程电压:3.3 V
Base Number Matches:1

W78M32VP-100BI 数据手册

 浏览型号W78M32VP-100BI的Datasheet PDF文件第2页浏览型号W78M32VP-100BI的Datasheet PDF文件第3页浏览型号W78M32VP-100BI的Datasheet PDF文件第4页浏览型号W78M32VP-100BI的Datasheet PDF文件第5页浏览型号W78M32VP-100BI的Datasheet PDF文件第6页浏览型号W78M32VP-100BI的Datasheet PDF文件第7页 
W78M32VP-XBX  
8Mx32 NOR Flash 3.3V Page Mode Multi-Chip Package  
FEATURES  
GENERAL DESCRIPTION  
 Access Times of 110, 120ns  
The W78M32VP-XBX is a 256Mb, 3.3 volt-only Page Mode  
memory device.  
 Packaging  
The device offers fast page access times allowing high speed  
microprocessors to operate without wait states. To eliminate bus  
contention the device has separate chip enable (CS#), write enable  
(WE#) and output enable (OE#) controls.  
• 159 PBGA, 13x22mm – 1.27mm pitch  
 Page Mode  
• Page size is 8 words: Fast page read access from  
random locations within the page.  
The device offers uniform 64 Kword (128Kb) Sectors:  
 Uniform Sector Architecture  
• One hundred twenty-eight 64 kword  
 Single power supply operation  
• 3 volt read, erase, and program operations  
 I/O Control  
PAGE MODE FEATURES  
The page size is 8 words.After initial page access is accomplished,  
the page mode operation provides fast read access speed of  
random locations within that page.  
STANDARD FLASH MEMORY FEATURES  
The device requires a 3.3 volt power supply for both read and write  
functions. Internally generated and regulated voltages are provided  
for the program and erase operations Page Mode Features  
• All input levels (address, control, and DQ input levels)  
and outputs are determined by voltage on VIO input. VIO  
range is 1.65 to VCC  
 Write operation status bits indicate program and erase  
operation completion  
DEVICE OPERATIONS  
 Suspend and Resume commands for program and erase  
This section describes the read, program, erase, handshaking,  
and reset features of the Flash devices. Operations are initiated by  
writing specic commands or a sequence with specic address and  
data patterns into the command registers ( see Table 38 and Table  
39). The command register itself does not occupy andy addressable  
memory location; rather, it is composed of latches that store the  
commands, along with the address and data information needed  
to execute the command. The contents of the register serves as  
input to the internal state machine and the state machine outputs  
dictate the function of the device. Writing incorrect address and  
data values or writing them in an improper sequence may place  
the device in an unknown state, in which case the system must  
pull the RESET# pin low or power cycle the device to return the  
device to the reading array data mode.  
operations  
 Hardware Reset# input resets device  
 WP#/ACC Input  
• Accelerates programming time for greater throughput.  
• Protects rst and last sector regardless of sector  
protection settings  
 Secured Silicon Sector region  
• 128-word sector for permanent, secure identication  
through an 8-word random Electronic Serial Number,  
accessible through a command sequence  
• May be programmed and locked at the factory or by the  
customer  
 100,000 erase cycles per sector typical  
 20-year data retention typical  
DEVICE OPERATION TABLE  
The device must be setup appropriately for each operation. Table  
2 describes the required state of each control pin for any particular  
operation.  
* This product is subject to change without notice.  
VersatileIO™ (VIO) CONTROL  
The VersatileIO™ (VIO) control allows the host system to set the  
voltage levels that the device generates and tolerates on all inputs  
and outputs (address, control, and DQ signals). VIO range is 1.65  
to VCC  
.
For example, a VIO of 1.65-3.6 volts allows for I/O at the 1.8 or 3  
volt levels, driving and receiving signals to and from other 1.8 or  
3 V devices on the same data bus.  
Continued on page 3  
Microsemi Corporation reserves the right to change products or specications without notice.  
August 2011 © 2011 Microsemi Corporation. All rights reserved.  
Rev. 15  
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com  

与W78M32VP-100BI相关器件

型号 品牌 获取价格 描述 数据表
W78M32VP-100BM MERCURY

获取价格

Flash,
W78M32VP110BI MERCURY

获取价格

Flash, 8MX32, 110ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159
W78M32VP-120BI MERCURY

获取价格

Flash, 8MX32, 120ns, PBGA159, BGA-159
W78M32V-XBX WEDC

获取价格

8Mx32 Flash 3.3V Page Mode Simultaneous Read/Write Operation Multi-Chip Package
W78M64110SBC WEDC

获取价格

Flash, 8MX64, 110ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159
W78M64110SBI WEDC

获取价格

Flash, 8MX64, 110ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159
W78M64110SBM WEDC

获取价格

Flash, 8MX64, 110ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159
W78M64110SBM MICROSEMI

获取价格

Flash, 8MX64, 110ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159
W78M64120SBC WEDC

获取价格

Flash, 8MX64, 120ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159
W78M64120SBI WEDC

获取价格

Flash, 8MX64, 120ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159