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W77LE532A25PL PDF预览

W77LE532A25PL

更新时间: 2024-01-01 15:57:25
品牌 Logo 应用领域
华邦 - WINBOND 微控制器
页数 文件大小 规格书
85页 443K
描述
Microcontroller, 8-Bit, FLASH, 8051 CPU, 25MHz, CMOS, PQCC44, ROHS COMPLIANT, PLASTIC, LCC-44

W77LE532A25PL 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:LCC包装说明:ROHS COMPLIANT, PLASTIC, LCC-44
针数:44Reach Compliance Code:unknown
HTS代码:8542.31.00.01风险等级:5.84
具有ADC:NO地址总线宽度:16
位大小:8CPU系列:8051
最大时钟频率:25 MHzDAC 通道:NO
DMA 通道:NO外部数据总线宽度:8
JESD-30 代码:S-PQCC-J44长度:16.59 mm
I/O 线路数量:36端子数量:44
最高工作温度:70 °C最低工作温度:
PWM 通道:NO封装主体材料:PLASTIC/EPOXY
封装代码:QCCJ封装等效代码:LDCC44,.7SQ
封装形状:SQUARE封装形式:CHIP CARRIER
峰值回流温度(摄氏度):NOT SPECIFIED电源:3/5 V
认证状态:Not QualifiedRAM(字节):256
ROM(单词):65536ROM可编程性:FLASH
座面最大高度:4.699 mm速度:25 MHz
子类别:Microcontrollers最大压摆率:30 mA
最大供电电压:5.5 V最小供电电压:2.7 V
标称供电电压:4.5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:J BEND端子节距:1.27 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:16.59 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER
Base Number Matches:1

W77LE532A25PL 数据手册

 浏览型号W77LE532A25PL的Datasheet PDF文件第2页浏览型号W77LE532A25PL的Datasheet PDF文件第3页浏览型号W77LE532A25PL的Datasheet PDF文件第4页浏览型号W77LE532A25PL的Datasheet PDF文件第5页浏览型号W77LE532A25PL的Datasheet PDF文件第6页浏览型号W77LE532A25PL的Datasheet PDF文件第7页 
W77LE532 Data Sheet  
8-BIT MICROCONTROLLER  
Table of Contents-  
1.  
GENERAL DESCRIPTION ......................................................................................................... 2  
FEATURES................................................................................................................................. 2  
PIN CONFIGURATIONS ............................................................................................................ 3  
PIN DESCRIPTION..................................................................................................................... 4  
BLOCK DIAGRAM ...................................................................................................................... 6  
FUNCTIONAL DESCRIPTION ................................................................................................... 7  
MEMORY ORGANIZATION ....................................................................................................... 8  
INSTRUCTION.......................................................................................................................... 33  
INSTRUCTION TIMING............................................................................................................ 34  
POWER MANAGEMENT.......................................................................................................... 42  
RESET CONDITIONS............................................................................................................... 44  
RESET STATE.......................................................................................................................... 45  
PROGRAMMABLE TIMERS/COUNTERS ............................................................................... 49  
TIMED ACCESS PROTECTION .............................................................................................. 64  
H/W REBOOT MODE (BOOT FROM 4K BYTES OF LDFLASH )........................................... 66  
IN-SYSTEM PROGRAMMING ................................................................................................. 67  
16.1 The Loader Program locates at LDFLASH memory..................................................... 67  
16.2 The Loader Program locates at APFLASH memory. ................................................... 67  
ON-CHIP FLASH EPROM CHARACTERISTICS..................................................................... 67  
SECURITY BITS....................................................................................................................... 70  
ELECTRICAL CHARACTERISTIC ........................................................................................... 71  
19.1 Absolute Maximum Ratings.......................................................................................... 71  
19.2 DC Characteristics........................................................................................................ 71  
19.3 AC Characteristics........................................................................................................ 73  
TYPICAL APPLICATION CIRCUITS ........................................................................................ 77  
20.1 Expanded External Program Memory and Crystal....................................................... 77  
20.2 Expanded External Data Memory and Oscillator ......................................................... 78  
PACKAGE DIMENSIONS......................................................................................................... 78  
21.1 40-pin DIP..................................................................................................................... 78  
21.2 44-pin PLCC ................................................................................................................. 79  
21.3 44-pin QFP.................................................................................................................... 79  
APPLICATION NOTE ............................................................................................................... 80  
REVISION HISTORY................................................................................................................ 85  
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Publication Release Date: Aug. 19, 2005  
- 1 -  
Revision A4  

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