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W77LE532-25 PDF预览

W77LE532-25

更新时间: 2024-02-20 08:58:49
品牌 Logo 应用领域
华邦 - WINBOND 时钟微控制器光电二极管外围集成电路
页数 文件大小 规格书
85页 738K
描述
Microcontroller, 8-Bit, FLASH, 8051 CPU, 25MHz, CMOS, PDIP40, DIP-40

W77LE532-25 技术参数

生命周期:Obsolete包装说明:DIP, DIP40,.6
Reach Compliance Code:compliant风险等级:5.83
具有ADC:NO地址总线宽度:16
位大小:8CPU系列:8051
最大时钟频率:25 MHzDAC 通道:NO
DMA 通道:NO外部数据总线宽度:8
JESD-30 代码:R-PDIP-T40长度:52.325 mm
I/O 线路数量:32端子数量:40
最高工作温度:70 °C最低工作温度:
PWM 通道:NO封装主体材料:PLASTIC/EPOXY
封装代码:DIP封装等效代码:DIP40,.6
封装形状:RECTANGULAR封装形式:IN-LINE
电源:3/5 V认证状态:Not Qualified
RAM(字节):256ROM(单词):65536
ROM可编程性:FLASH速度:25 MHz
子类别:Microcontrollers最大压摆率:30 mA
最大供电电压:5.5 V最小供电电压:2.7 V
标称供电电压:4.5 V表面贴装:NO
技术:CMOS温度等级:COMMERCIAL
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL宽度:15.24 mm

W77LE532-25 数据手册

 浏览型号W77LE532-25的Datasheet PDF文件第2页浏览型号W77LE532-25的Datasheet PDF文件第3页浏览型号W77LE532-25的Datasheet PDF文件第4页浏览型号W77LE532-25的Datasheet PDF文件第5页浏览型号W77LE532-25的Datasheet PDF文件第6页浏览型号W77LE532-25的Datasheet PDF文件第7页 
Preliminary W77LE532  
8-BIT MICROCONTROLLER  
Table of Contents-  
1.  
GENERAL DESCRIPTION.................................................................................................................. 2  
FEATURES ......................................................................................................................................... 2  
PIN CONFIGURATIONS ..................................................................................................................... 3  
PIN DESCRIPTION ............................................................................................................................. 4  
BLOCK DIAGRAM............................................................................................................................... 6  
FUNCTIONAL DESCRIPTION ............................................................................................................ 7  
MEMORY ORGANIZATION ................................................................................................................ 8  
INSTRUCTION.................................................................................................................................. 33  
INSTRUCTION TIMING .................................................................................................................... 33  
POWER MANAGEMENT .................................................................................................................. 41  
RESET CONDITIONS ....................................................................................................................... 43  
RESET STATE.................................................................................................................................. 44  
PROGRAMMABLE TIMERS/COUNTERS ........................................................................................ 48  
TIMED ACCESS PROTECTION ....................................................................................................... 63  
IN-SYSTEM PROGRAMMING .......................................................................................................... 66  
2.  
3.  
4.  
5.  
6.  
7.  
8.  
9.  
10.  
11.  
12.  
13.  
14.  
15.  
15.1  
The Loader Program locates at LDFLASH memory. ..................................................................66  
15.2  
The Loader Program locates at APFLASH memory...................................................................66  
16.  
17.  
18.  
ON-CHIP FLASH EPROM CHARACTERISTICS.............................................................................. 66  
SECURITY BITS................................................................................................................................ 69  
ELECTRICAL CHARACTERISTIC.................................................................................................... 70  
18.1  
18.2  
18.3  
Absolute Maximum Ratings........................................................................................................70  
DC Characteristics......................................................................................................................70  
AC Characteristics......................................................................................................................72  
19.  
20.  
TYPICAL APPLICATION CIRCUITS................................................................................................. 77  
19.1  
Expanded External Program Memory and Crystal......................................................................77  
19.2  
Expanded External Data Memory and Oscillator........................................................................78  
PACKAGE DIMENSIONS.................................................................................................................. 78  
20.1  
20.2  
20.3  
40-pin DIP ..................................................................................................................................78  
44-pin PLCC...............................................................................................................................79  
44-pin QFP.................................................................................................................................79  
21.  
22.  
APPLICATION NOTE........................................................................................................................ 80  
21.1 In-system Programming Software Examples..............................................................................80  
REVISION HISTORY......................................................................................................................... 85  
Publication Release Date: May 14, 2003  
- 1 -  
Revision A1  

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