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W77LE516A25FL PDF预览

W77LE516A25FL

更新时间: 2024-11-11 19:43:47
品牌 Logo 应用领域
华邦 - WINBOND 微控制器
页数 文件大小 规格书
86页 650K
描述
Microcontroller, 8-Bit, FLASH, 8051 CPU, 25MHz, CMOS, PQFP44

W77LE516A25FL 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:QFP包装说明:QFP, QFP44,.5SQ,32
针数:44Reach Compliance Code:unknown
风险等级:5.8位大小:8
CPU系列:8051JESD-30 代码:S-PQFP-G44
端子数量:44最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:QFP封装等效代码:QFP44,.5SQ,32
封装形状:SQUARE封装形式:FLATPACK
电源:3/5 V认证状态:Not Qualified
RAM(字节):256ROM(单词):65536
ROM可编程性:FLASH速度:25 MHz
子类别:Microcontrollers最大压摆率:30 mA
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:GULL WING
端子节距:0.8 mm端子位置:QUAD
Base Number Matches:1

W77LE516A25FL 数据手册

 浏览型号W77LE516A25FL的Datasheet PDF文件第2页浏览型号W77LE516A25FL的Datasheet PDF文件第3页浏览型号W77LE516A25FL的Datasheet PDF文件第4页浏览型号W77LE516A25FL的Datasheet PDF文件第5页浏览型号W77LE516A25FL的Datasheet PDF文件第6页浏览型号W77LE516A25FL的Datasheet PDF文件第7页 
W77LE516 Data Sheet  
8-BIT MICROCONTROLLER  
Table of Contents-  
1.  
GENERAL DESCRIPTION.................................................................................................................. 2  
FEATURES ......................................................................................................................................... 2  
PIN CONFIGURATIONS..................................................................................................................... 3  
PIN DESCRIPTION............................................................................................................................. 4  
BLOCK DIAGRAM............................................................................................................................... 6  
FUNCTIONAL DESCRIPTION............................................................................................................ 7  
MEMORY ORGANIZATION................................................................................................................ 8  
INSTRUCTION.................................................................................................................................. 32  
INSTRUCTION TIMING .................................................................................................................... 34  
POWER MANAGEMENT .................................................................................................................. 42  
RESET CONDITIONS....................................................................................................................... 43  
RESET STATE.................................................................................................................................. 45  
PROGRAMMABLE TIMERS/COUNTERS........................................................................................ 49  
TIMED ACCESS PROTECTION....................................................................................................... 64  
IN-SYSTEM PROGRAMMING.......................................................................................................... 67  
2.  
3.  
4.  
5.  
6.  
7.  
8.  
9.  
10.  
11.  
12.  
13.  
14.  
15.  
15.1  
15.2  
The Loader Program locates at LDFLASH memory. ..................................................................67  
The Loader Program locates at APFLASH memory...................................................................67  
16.  
17.  
18.  
ON-CHIP FLASH EPROM CHARACTERISTICS.............................................................................. 67  
SECURITY BITS ............................................................................................................................... 70  
ELECTRICAL CHARACTERISTIC.................................................................................................... 71  
18.1  
18.2  
18.3  
Absolute Maximum Ratings........................................................................................................71  
DC Characteristics......................................................................................................................71  
AC Characteristics......................................................................................................................73  
19.  
20.  
TYPICAL APPLICATION CIRCUITS................................................................................................. 78  
19.1  
19.2  
Expanded External Program Memory and Crystal......................................................................78  
Expanded External Data Memory and Oscillator........................................................................79  
PACKAGE DIMENSIONS ................................................................................................................. 79  
20.1  
20.2  
20.3  
40-pin DIP ..................................................................................................................................79  
44-pin PLCC...............................................................................................................................80  
44-pin QFP.................................................................................................................................80  
21.  
22.  
APPLICATION NOTE........................................................................................................................ 81  
21.1 In-system Programming Software Examples..............................................................................81  
REVISION HISTORY ........................................................................................................................ 86  
Publication Release Date: April 19, 2005  
- 1 -  
Revision A3  

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