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W541L203 PDF预览

W541L203

更新时间: 2024-02-09 16:18:07
品牌 Logo 应用领域
华邦 - WINBOND 可编程只读存储器时钟微控制器光电二极管外围集成电路
页数 文件大小 规格书
15页 238K
描述
Microcontroller, 4-Bit, OTPROM, 4MHz, CMOS, PDIP20, 0.300 INCH, PLASTIC, DIP-20

W541L203 技术参数

生命周期:Transferred零件包装代码:DIP
包装说明:DIP,针数:20
Reach Compliance Code:unknownHTS代码:8542.31.00.01
风险等级:5.52具有ADC:NO
位大小:4最大时钟频率:4 MHz
DAC 通道:NODMA 通道:NO
JESD-30 代码:R-PDIP-T20长度:20.06 mm
I/O 线路数量:12端子数量:20
最高工作温度:70 °C最低工作温度:
PWM 通道:NO封装主体材料:PLASTIC/EPOXY
封装代码:DIP封装形状:RECTANGULAR
封装形式:IN-LINE认证状态:Not Qualified
ROM可编程性:OTPROM座面最大高度:4.45 mm
速度:4 MHz最大供电电压:1.8 V
最小供电电压:1.2 V标称供电电压:1.5 V
表面贴装:NO技术:CMOS
温度等级:COMMERCIAL端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
宽度:7.62 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER
Base Number Matches:1

W541L203 数据手册

 浏览型号W541L203的Datasheet PDF文件第2页浏览型号W541L203的Datasheet PDF文件第3页浏览型号W541L203的Datasheet PDF文件第4页浏览型号W541L203的Datasheet PDF文件第5页浏览型号W541L203的Datasheet PDF文件第6页浏览型号W541L203的Datasheet PDF文件第7页 
Prelimanary W541L20X Data Sheet  
4-BIT MICROCONTROLLER  
Table of Contents-  
1. GENERAL DESCRIPTION .............................................................................................................. 2  
2. FEATURES ...................................................................................................................................... 2  
3. BLOCK DIAGRAM ........................................................................................................................... 4  
4. PIN CONFIGURATIONS.................................................................................................................. 5  
5. PIN DESCRIPTION.......................................................................................................................... 6  
6. ELECTRICAL CHARACTERISTICS................................................................................................ 7  
6.1 Absolute Maximum Ratings ................................................................................................... 7  
6.2 DC Characteristics................................................................................................................. 7  
6.3 AC Characteristics ................................................................................................................. 8  
7. APPLICATION CIRCUIT.................................................................................................................. 9  
8. PACKAGE DIMENSIONS.............................................................................................................. 10  
8.1 18-Lead PDIP-300mil........................................................................................................... 10  
8.2 20-Lead PDIP ...................................................................................................................... 11  
8.3 28-Lead PDIP Skinny........................................................................................................... 12  
8.4 20-Lead SOP-300mil ........................................................................................................... 13  
8.5 28-Lead SOP-300mil ........................................................................................................... 14  
9. REVISION HISTORY..................................................................................................................... 15  
Publication Release Date: June 3, 2003  
- 1 -  
Revision A4  

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