Datasheet > W3H32M64EA-400SBM

W3H32M64EA-400SBM

更新时间： 2024-11-11 21:06:31

品牌	Logo	应用领域
玛居礼 - MERCURY		动态存储器双倍数据速率内存集成电路
页数	文件大小	规格书
27页	1197K
描述
DDR DRAM, 32MX64, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208

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W3H32M64EA-XSBX

ADVANCED*

256MB – 32M x 64 DDR2 SDRAM Single-Rank 208 PBGA MCP

FEATURES

BENEFITS

 Data rate = 667, 533, 400 Mb/s

 62% Space savings vs. FBGA

 Package:

 Reduced part count

• 208 Plastic Ball Grid Array (PBGA), 16 x 20mm

• 1.0mm pitch

 42% I/O reduction vs FBGA

 Reduced trace lengths for lower parasitic capacitance

 Suitable for hi-reliability applications

 Supply Voltage = 1.8V ± 0.1V

 Differential data strobe (DQS, DQS#) per byte

 Internal, pipelined, double data rate architecture

 4-bit prefetch architecture

 Upgradeable to 64M x 64 density (contact factory for

information)

*This product is under development, is not qualiﬁed or characterized and is subject to change or

cancellation without notice.

 DLL for alignment of DQ and DQS transitions with clock

signal

TYPICAL APPLICATION

 Four internal banks for concurrent operation

(Per DDR2 SDRAM Die)

 Programmable Burst lengths: 4 or 8

 Auto Refresh and Self Refresh Modes

 On Die Termination (ODT)

RAM

 Adjustable data – output drive strength

 Programmable CAS latency: 3, 4 or 5

 Posted CAS additive latency: 0, 1, 2, 3 or 4

 Write latency = Read latency - 1* t_CK

 Commercial, Industrial and Military Temperature Ranges

 Organized as 32M x 64

DDR2/DDR3

W3X128M72-XBI

Host

FPGA/

Processor

SSD (SLC)

MSM32/MSM64 (SATA BGA)

W7N16GVHxxBI (PATA BGA)

M512/M256/M128 (SATA, 2.5in)

 Weight: W3H32M64EA-XSBX - 2.5 grams typical

FIGURE 1 – DENSITY COMPARISONS

CSP Approach (mm)

W3H32M64EA-XSBX

11.0

FBGA

19.0

W3H32M64EA-XSBX

Area

4 x 209mm²= 836mm²

4 x 90 balls = 360 balls

320mm²

62%

42%

I/O Count

208 Balls

Microsemi Corporation reserves the right to change products or speciﬁcations without notice.

Rev.1

Microsemi Corporation • (602) 437-1520 • www.microsemi.com

12 3 4 5 6 7...27

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与W3H32M64EA-400SBM相关器件

型号	品牌	获取价格	描述	数据表
W3H32M64EA-533SBC	MERCURY	获取价格	DDR DRAM, 32MX64, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208
W3H32M64EA-533SBI	MERCURY	获取价格	DDR DRAM, 32MX64, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208
W3H32M64EA-533SBM	MERCURY	获取价格	DDR DRAM, 32MX64, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208
W3H32M64EA-667SBC	MERCURY	获取价格	DDR DRAM, 32MX64, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208
W3H32M64EA-667SBI	MERCURY	获取价格	DDR DRAM, 32MX64, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208
W3H32M64EA-667SBM	MERCURY	获取价格	DDR DRAM, 32MX64, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208
W3H32M64E-ES	WEDC	获取价格	32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-ESC	WEDC	获取价格	32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-ESI	WEDC	获取价格	32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-ESM	WEDC	获取价格	32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package

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