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W29EE011P15Z PDF预览

W29EE011P15Z

更新时间: 2024-09-19 20:38:19
品牌 Logo 应用领域
华邦 - WINBOND 内存集成电路
页数 文件大小 规格书
26页 332K
描述
Flash, 128KX8, 150ns, PQCC32, LEAD FREE, PLASTIC, LCC-32

W29EE011P15Z 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:QFJ
包装说明:LEAD FREE, PLASTIC, LCC-32针数:32
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.51风险等级:5.82
最长访问时间:150 ns命令用户界面:NO
数据轮询:YES耐久性:1000 Write/Erase Cycles
JESD-30 代码:R-PQCC-J32JESD-609代码:e3
长度:13.97 mm内存密度:1048576 bit
内存集成电路类型:FLASH内存宽度:8
功能数量:1部门数/规模:1K
端子数量:32字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:128KX8封装主体材料:PLASTIC/EPOXY
封装代码:QCCJ封装等效代码:LDCC32,.5X.6
封装形状:RECTANGULAR封装形式:CHIP CARRIER
并行/串行:PARALLEL峰值回流温度(摄氏度):245
电源:5 V编程电压:5 V
认证状态:Not Qualified座面最大高度:3.56 mm
部门规模:128最大待机电流:0.0001 A
子类别:Flash Memories最大压摆率:0.05 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Matte Tin (Sn)端子形式:J BEND
端子节距:1.27 mm端子位置:QUAD
处于峰值回流温度下的最长时间:40切换位:YES
类型:NOR TYPE宽度:11.43 mm
最长写入周期时间 (tWC):10 msBase Number Matches:1

W29EE011P15Z 数据手册

 浏览型号W29EE011P15Z的Datasheet PDF文件第2页浏览型号W29EE011P15Z的Datasheet PDF文件第3页浏览型号W29EE011P15Z的Datasheet PDF文件第4页浏览型号W29EE011P15Z的Datasheet PDF文件第5页浏览型号W29EE011P15Z的Datasheet PDF文件第6页浏览型号W29EE011P15Z的Datasheet PDF文件第7页 
W29EE011  
128K × 8 CMOS FLASH MEMORY  
Table of Contents-  
1.  
2.  
3.  
4.  
5.  
6.  
GENERAL DESCRIPTION ......................................................................................................... 3  
FEATURES................................................................................................................................. 3  
PIN CONFIGURATIONS............................................................................................................. 4  
BLOCK DIAGRAM ...................................................................................................................... 5  
PIN DESCRIPTION..................................................................................................................... 5  
FUNCTIONAL DESCRIPTION.................................................................................................... 6  
6.1  
6.2  
6.3  
6.4  
6.5  
6.6  
6.7  
6.8  
Read Mode ..................................................................................................................... 6  
Page Write Mode............................................................................................................ 6  
Software-protected Data Write ....................................................................................... 6  
Hardware Data Protection .............................................................................................. 7  
Data Polling (DQ7)-Write Status Detection .................................................................... 7  
Toggle Bit (DQ6)-Write Status Detection........................................................................ 7  
5-Volt-only Software Chip Erase..................................................................................... 7  
Product Identification ...................................................................................................... 7  
7.  
8.  
TABLE OF OPERATING MODES .............................................................................................. 8  
7.1  
7.2  
Operating Mode Selection .............................................................................................. 8  
Command Codes for Software Data Protection ............................................................. 8  
7.2.1  
Software Data Protection Acquisition Flow...............................................................9  
7.3  
7.4  
Command Codes for Software Chip Erase .................................................................. 10  
7.3.1  
Software Chip Erase Acquisition Flow....................................................................10  
Command Codes for Product Identification.................................................................. 11  
7.4.1  
Software Product Identification Acquisition Flow ....................................................11  
ELECTRICAL CHARACTERISTICS......................................................................................... 12  
8.1  
Absolute Maximum Ratings.......................................................................................... 12  
8.2  
DC Characteristics........................................................................................................ 12  
8.2.1  
8.2.2  
8.2.3  
Operating Characteristics.......................................................................................12  
Power-up Timing ....................................................................................................12  
Capacitance............................................................................................................13  
8.3  
AC Characteristics........................................................................................................ 13  
8.3.1  
8.3.2  
8.3.3  
8.3.4  
8.3.5  
AC Test Conditions.................................................................................................13  
AC Test Load and Waveforms................................................................................13  
Read Cycle Timing Parameters..............................................................................14  
Byte/Page-write Cycle Timing Parameters .............................................................14  
Data Polling and Toggle Bit Timing Parameters.....................................................15  
9.  
TIMING WAVEFORMS............................................................................................................. 16  
9.1  
9.2  
9.3  
Read Cycle Timing Diagram......................................................................................... 16  
#WE Controlled Write Cycle Timing Diagram............................................................... 16  
#CE Controlled Write Cycle Timing Diagram ............................................................... 17  
Publication Release Date: April 11, 2006  
- 1 -  
Revision A18  

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