Datasheet > W2635A

W2635A

更新时间： 2024-11-10 08:07:43

品牌	Logo	应用领域
惠普 - HP		/
页数	文件大小	规格书
11页	534K
描述
BGA Probe Adapter for Infiniium Oscilloscopes

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W2635A 数据手册

W2635A and W2636A DDR3 BGA Probe

Adapter for Infiniium Oscilloscopes

Data Sheet

Superior probing for DDR3 compliance test and debug

The Agilent Technologies' W2635A

and W2636A DDR3 BGA probe

adapters provide signal access to

the clock, strobe, data, address

and command signals of the DDR3

BGA package for making electrical

and timing measurements with an

Infiniium oscilloscope. The DDR3

from the memory controller chip and

DRAM directly to the top side of the

BGA probe adapter where they can be

accessed with oscilloscope probes.

location could cause signal reflection,

resulting in non-monotonic edges.

This will cause error in your tests

such as slew rate, setup and hold time

measurements.

Buried resistors placed at the signals

inside the BGA probe adapter

When used with Agilent's U7231A

DDR3 compliance test application, the

BGA adapter provides a fast and easy

way to test, debug and characterize

your DDR3 designs. The tests covered

by the U7231A software are based on

the JEDEC (JESD79-3C) DDR3 SDRAM

Specification. The test application

offers a user-friendly setup wizard and

a comprehensive report that includes

margin analysis.

connect the probed signals to solder

pads designed to work with Agilent

InfiniiMax E2677A, N5381A, N5425A,

and N5426A differential solder-in

probe heads. These resistors isolate

the DDR3 signal and the probe

JEDEC specification (JESD79-3C) is

defined at the DRAM ballout, and the

ballout is difficult to access. The BGA

probe adapter provides direct signal

access to the BGA package for true

compliance testing.

loading effect. This design minimizes

capacitive loading of the probe heads

and allows high-speed operation

without impact on signal integrity.

The W2635A and W2636A DDR3

BGA probe adapters are soldered in

between the DRAM and PC board

or DIMM raw card where the DRAM

would normally be soldered. They

are designed with the PCB or DIMM

footprint on the bottom side and

the DRAM footprint on the top side.

The BGA adapter passes the signals

The JEDEC (Joint Electronic Device Engineering

Council) Solid State Technology Association is

a semiconductor engineering standardization

body of the Electronic Industries Alliance (EIA), a

trade association that represents all areas of the

electronic industry.

Probing at the right location is also

an important consideration for DDR3

measurement. Many designs have

vias or designed-in probe points, but

they do not always produce good

signal integrity. Probing at the wrong

12 3 4 5 6 7...11

中文翻译

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与W2635A相关器件

型号	品牌	获取价格	描述	数据表
W2641A	HP	获取价格	DisplayPort Test Point Access Adapter
W2642A	AGILENT	获取价格	DisplayPort AUX Channel Controller
W26A02B-70LE	WINBOND	获取价格	Standard SRAM, 128KX16, 70ns, CMOS, PBGA48, TFBGA-48
W26A02B-70LI	WINBOND	获取价格	Standard SRAM, 128KX16, 70ns, CMOS, PBGA48, TFBGA-48
W26A02H-70LE	WINBOND	获取价格	Standard SRAM, 128KX16, 70ns, CMOS, PDSO44, TSOP2-44
W26A02H-70LI	WINBOND	获取价格	Standard SRAM, 128KX16, 70ns, CMOS, PDSO44, TSOP2-44
W26A041B70LE	WINBOND	获取价格	Standard SRAM, 256KX16, 70ns, CMOS, PBGA48, TFBGA-48
W26A041B70LI	WINBOND	获取价格	Standard SRAM, 256KX16, 70ns, CMOS, PBGA48, TFBGA-48
W26A041H70LE	WINBOND	获取价格	Standard SRAM, 256KX16, 70ns, CMOS, PDSO44, TSOP2-44
W26A041H70LI	WINBOND	获取价格	Standard SRAM, 256KX16, 70ns, CMOS, PDSO44, TSOP2-44

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