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W25X80LZPEG PDF预览

W25X80LZPEG

更新时间: 2024-11-08 08:08:19
品牌 Logo 应用领域
华邦 - WINBOND 闪存存储内存集成电路光电二极管输出元件时钟
页数 文件大小 规格书
46页 1226K
描述
1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X80LZPEG 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:SON包装说明:HVSON, SOLCC8,.25
针数:8Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.76Is Samacsys:N
最大时钟频率 (fCLK):40 MHz数据保留时间-最小值:20
耐久性:100000 Write/Erase CyclesJESD-30 代码:R-PDSO-N8
JESD-609代码:e3长度:6 mm
内存密度:8388608 bit内存集成电路类型:FLASH
内存宽度:8功能数量:1
端子数量:8字数:1048576 words
字数代码:1000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:
组织:1MX8封装主体材料:PLASTIC/EPOXY
封装代码:HVSON封装等效代码:SOLCC8,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
并行/串行:SERIAL峰值回流温度(摄氏度):NOT SPECIFIED
电源:2.5/3 V编程电压:3.3 V
认证状态:Not Qualified座面最大高度:0.8 mm
串行总线类型:SPI最大待机电流:0.00001 A
子类别:Flash Memories最大压摆率:0.02 mA
最大供电电压 (Vsup):3.3 V最小供电电压 (Vsup):2.3 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:MATTE TIN端子形式:NO LEAD
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED类型:NOR TYPE
宽度:5 mm写保护:HARDWARE/SOFTWARE
Base Number Matches:1

W25X80LZPEG 数据手册

 浏览型号W25X80LZPEG的Datasheet PDF文件第2页浏览型号W25X80LZPEG的Datasheet PDF文件第3页浏览型号W25X80LZPEG的Datasheet PDF文件第4页浏览型号W25X80LZPEG的Datasheet PDF文件第5页浏览型号W25X80LZPEG的Datasheet PDF文件第6页浏览型号W25X80LZPEG的Datasheet PDF文件第7页 
W25X10L, W25X20L, W25X40L, W25X80L  
1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT  
2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS  
AND DUAL OUTPUT SPI  
Publication Release Date: February 27, 2008  
- 1 -  
Revision I  

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