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W25X64VSSIG PDF预览

W25X64VSSIG

更新时间: 2024-11-08 04:25:43
品牌 Logo 应用领域
华邦 - WINBOND 闪存输出元件
页数 文件大小 规格书
47页 1293K
描述
16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X64VSSIG 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:SOIC包装说明:0.208 INCH, GREEN, PLASTIC, SOIC-8
针数:8Reach Compliance Code:unknown
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.84最大时钟频率 (fCLK):33 MHz
JESD-30 代码:S-PDSO-G8长度:5.27 mm
内存密度:67108864 bit内存集成电路类型:FLASH
内存宽度:1功能数量:1
端子数量:8字数:67108864 words
字数代码:64000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:64MX1封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装形状:SQUARE
封装形式:SMALL OUTLINE并行/串行:SERIAL
编程电压:2.7 V认证状态:Not Qualified
座面最大高度:2.16 mm最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
类型:NOR TYPE宽度:5.27 mm
Base Number Matches:1

W25X64VSSIG 数据手册

 浏览型号W25X64VSSIG的Datasheet PDF文件第2页浏览型号W25X64VSSIG的Datasheet PDF文件第3页浏览型号W25X64VSSIG的Datasheet PDF文件第4页浏览型号W25X64VSSIG的Datasheet PDF文件第5页浏览型号W25X64VSSIG的Datasheet PDF文件第6页浏览型号W25X64VSSIG的Datasheet PDF文件第7页 
W25X16, W25X32, W25X64  
16M-BIT, 32M-BIT, AND 64M-BIT  
SERIAL FLASH MEMORY WITH  
4KB SECTORS AND DUAL OUTPUT SPI  
Publication Release Date:  
- 1 -  
February 26, 2007, Revision E  

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