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W25X64VDAIZ PDF预览

W25X64VDAIZ

更新时间: 2024-11-08 04:25:43
品牌 Logo 应用领域
华邦 - WINBOND 闪存输出元件
页数 文件大小 规格书
47页 1293K
描述
16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X64VDAIZ 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:DIP包装说明:DIP-8
针数:8Reach Compliance Code:compliant
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.84最大时钟频率 (fCLK):50 MHz
数据保留时间-最小值:20耐久性:100000 Write/Erase Cycles
JESD-30 代码:R-PDIP-T8长度:9.27 mm
内存密度:67108864 bit内存集成电路类型:FLASH
内存宽度:8功能数量:1
端子数量:8字数:8388608 words
字数代码:8000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:8MX8封装主体材料:PLASTIC/EPOXY
封装代码:DIP封装等效代码:DIP8,.3
封装形状:RECTANGULAR封装形式:IN-LINE
并行/串行:SERIAL峰值回流温度(摄氏度):NOT SPECIFIED
电源:3/3.3 V编程电压:2.7 V
认证状态:Not Qualified座面最大高度:5.33 mm
串行总线类型:SPI最大待机电流:0.00001 A
子类别:Flash Memories最大压摆率:0.018 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:NO
技术:CMOS温度等级:INDUSTRIAL
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
类型:NOR TYPE宽度:7.62 mm
写保护:HARDWARE/SOFTWAREBase Number Matches:1

W25X64VDAIZ 数据手册

 浏览型号W25X64VDAIZ的Datasheet PDF文件第2页浏览型号W25X64VDAIZ的Datasheet PDF文件第3页浏览型号W25X64VDAIZ的Datasheet PDF文件第4页浏览型号W25X64VDAIZ的Datasheet PDF文件第5页浏览型号W25X64VDAIZ的Datasheet PDF文件第6页浏览型号W25X64VDAIZ的Datasheet PDF文件第7页 
W25X16, W25X32, W25X64  
16M-BIT, 32M-BIT, AND 64M-BIT  
SERIAL FLASH MEMORY WITH  
4KB SECTORS AND DUAL OUTPUT SPI  
Publication Release Date:  
- 1 -  
February 26, 2007, Revision E  

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