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W25X64BVZEIG PDF预览

W25X64BVZEIG

更新时间: 2024-11-08 08:08:23
品牌 Logo 应用领域
华邦 - WINBOND 闪存存储内存集成电路光电二极管输出元件时钟
页数 文件大小 规格书
43页 1432K
描述
64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X64BVZEIG 技术参数

是否Rohs认证:符合生命周期:Obsolete
零件包装代码:SON包装说明:8 X 6 MM, GREEN, WSON-8
针数:8Reach Compliance Code:unknown
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.84Is Samacsys:N
最大时钟频率 (fCLK):80 MHzJESD-30 代码:R-PDSO-N8
长度:8 mm内存密度:67108864 bit
内存集成电路类型:FLASH内存宽度:1
功能数量:1端子数量:8
字数:67108864 words字数代码:64000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:64MX1
封装主体材料:PLASTIC/EPOXY封装代码:HVSON
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
并行/串行:SERIAL编程电压:2.7 V
认证状态:Not Qualified座面最大高度:0.8 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:NO LEAD端子节距:1.27 mm
端子位置:DUAL宽度:6 mm
Base Number Matches:1

W25X64BVZEIG 数据手册

 浏览型号W25X64BVZEIG的Datasheet PDF文件第2页浏览型号W25X64BVZEIG的Datasheet PDF文件第3页浏览型号W25X64BVZEIG的Datasheet PDF文件第4页浏览型号W25X64BVZEIG的Datasheet PDF文件第5页浏览型号W25X64BVZEIG的Datasheet PDF文件第6页浏览型号W25X64BVZEIG的Datasheet PDF文件第7页 
W25X64BV  
64M-BIT  
SERIAL FLASH MEMORY WITH  
4KB SECTORS AND DUAL OUTPUT SPI  
The W25Q64BV is recommended for all new 64Mb designs. The W25X64BV is  
available for existing designs that require "25X" device ID for firmware  
compatibility.  
Publication Release Date: August 7, 2009  
Preliminary -- Revision B  
- 1-  

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