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W25X64-VSFI-Z PDF预览

W25X64-VSFI-Z

更新时间: 2024-09-20 13:15:35
品牌 Logo 应用领域
华邦 - WINBOND 闪存输出元件
页数 文件大小 规格书
47页 1293K
描述
64MX1 FLASH 2.7V PROM, PDSO16, 0.300 INCH, ROHS COMPLIANT, SOIC-16

W25X64-VSFI-Z 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:SOP,针数:16
Reach Compliance Code:unknown风险等级:5.84
Is Samacsys:N最大时钟频率 (fCLK):33 MHz
JESD-30 代码:R-PDSO-G16JESD-609代码:e3
长度:10.285 mm内存密度:64094208 bit
内存集成电路类型:FLASH内存宽度:1
湿度敏感等级:3功能数量:1
端子数量:16字数:64094208 words
字数代码:64000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:64MX1封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装形状:RECTANGULAR
封装形式:SMALL OUTLINE并行/串行:SERIAL
峰值回流温度(摄氏度):260编程电压:2.7 V
认证状态:Not Qualified座面最大高度:2.64 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
温度等级:INDUSTRIAL端子面层:MATTE TIN
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:40
宽度:7.49 mmBase Number Matches:1

W25X64-VSFI-Z 数据手册

 浏览型号W25X64-VSFI-Z的Datasheet PDF文件第2页浏览型号W25X64-VSFI-Z的Datasheet PDF文件第3页浏览型号W25X64-VSFI-Z的Datasheet PDF文件第4页浏览型号W25X64-VSFI-Z的Datasheet PDF文件第5页浏览型号W25X64-VSFI-Z的Datasheet PDF文件第6页浏览型号W25X64-VSFI-Z的Datasheet PDF文件第7页 
W25X16, W25X32, W25X64  
16M-BIT, 32M-BIT, AND 64M-BIT  
SERIAL FLASH MEMORY WITH  
4KB SECTORS AND DUAL OUTPUT SPI  
Publication Release Date:  
- 1 -  
February 26, 2007, Revision E  

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