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W25X32VZPIG PDF预览

W25X32VZPIG

更新时间: 2024-11-08 03:08:07
品牌 Logo 应用领域
华邦 - WINBOND 闪存输出元件
页数 文件大小 规格书
47页 1293K
描述
16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X32VZPIG 技术参数

生命周期:Obsolete零件包装代码:SON
包装说明:HVSON,针数:8
Reach Compliance Code:unknownECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:5.82
最大时钟频率 (fCLK):33 MHzJESD-30 代码:R-PDSO-N8
长度:6 mm内存密度:33554432 bit
内存集成电路类型:FLASH内存宽度:1
功能数量:1端子数量:8
字数:33554432 words字数代码:32000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:32MX1
封装主体材料:PLASTIC/EPOXY封装代码:HVSON
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
并行/串行:SERIAL编程电压:2.7 V
认证状态:Not Qualified座面最大高度:0.8 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:NO LEAD端子节距:1.27 mm
端子位置:DUAL类型:NOR TYPE
宽度:5 mm

W25X32VZPIG 数据手册

 浏览型号W25X32VZPIG的Datasheet PDF文件第2页浏览型号W25X32VZPIG的Datasheet PDF文件第3页浏览型号W25X32VZPIG的Datasheet PDF文件第4页浏览型号W25X32VZPIG的Datasheet PDF文件第5页浏览型号W25X32VZPIG的Datasheet PDF文件第6页浏览型号W25X32VZPIG的Datasheet PDF文件第7页 
W25X16, W25X32, W25X64  
16M-BIT, 32M-BIT, AND 64M-BIT  
SERIAL FLASH MEMORY WITH  
4KB SECTORS AND DUAL OUTPUT SPI  
Publication Release Date:  
- 1 -  
February 26, 2007, Revision E  

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