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W25X32VZEIZ PDF预览

W25X32VZEIZ

更新时间: 2024-11-08 03:09:07
品牌 Logo 应用领域
华邦 - WINBOND 闪存输出元件
页数 文件大小 规格书
47页 1293K
描述
16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X32VZEIZ 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:SON包装说明:SON, SOLCC8,.25
针数:8Reach Compliance Code:compliant
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.84最大时钟频率 (fCLK):33 MHz
数据保留时间-最小值:20耐久性:100000 Write/Erase Cycles
JESD-30 代码:R-PDSO-N8长度:8 mm
内存密度:33554432 bit内存集成电路类型:FLASH
内存宽度:1功能数量:1
端子数量:8字数:33554432 words
字数代码:32000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:32MX1封装主体材料:PLASTIC/EPOXY
封装代码:SON封装等效代码:SOLCC8,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
并行/串行:SERIAL峰值回流温度(摄氏度):NOT SPECIFIED
电源:3/3.3 V编程电压:2.7 V
认证状态:Not Qualified串行总线类型:SPI
最大待机电流:0.00001 A子类别:Flash Memories
最大压摆率:0.025 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:NO LEAD
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED类型:NOR TYPE
宽度:6 mm写保护:HARDWARE/SOFTWARE
Base Number Matches:1

W25X32VZEIZ 数据手册

 浏览型号W25X32VZEIZ的Datasheet PDF文件第2页浏览型号W25X32VZEIZ的Datasheet PDF文件第3页浏览型号W25X32VZEIZ的Datasheet PDF文件第4页浏览型号W25X32VZEIZ的Datasheet PDF文件第5页浏览型号W25X32VZEIZ的Datasheet PDF文件第6页浏览型号W25X32VZEIZ的Datasheet PDF文件第7页 
W25X16, W25X32, W25X64  
16M-BIT, 32M-BIT, AND 64M-BIT  
SERIAL FLASH MEMORY WITH  
4KB SECTORS AND DUAL OUTPUT SPI  
Publication Release Date:  
- 1 -  
February 26, 2007, Revision E  

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