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W25X32BVSSIG PDF预览

W25X32BVSSIG

更新时间: 2024-09-20 08:08:23
品牌 Logo 应用领域
华邦 - WINBOND 闪存存储内存集成电路光电二极管输出元件时钟
页数 文件大小 规格书
45页 1466K
描述
32M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X32BVSSIG 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:SOIC包装说明:0.208 INCH, GREEN, PLASTIC, SOIC-8
针数:8Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.84Is Samacsys:N
最大时钟频率 (fCLK):80 MHzJESD-30 代码:R-PDSO-G8
长度:5.28 mm内存密度:8388608 bit
内存集成电路类型:FLASH内存宽度:32
功能数量:1端子数量:8
字数:262144 words字数代码:256000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:256KX32
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
并行/串行:SERIAL编程电压:2.7 V
认证状态:Not Qualified座面最大高度:2.16 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
宽度:5.23 mmBase Number Matches:1

W25X32BVSSIG 数据手册

 浏览型号W25X32BVSSIG的Datasheet PDF文件第2页浏览型号W25X32BVSSIG的Datasheet PDF文件第3页浏览型号W25X32BVSSIG的Datasheet PDF文件第4页浏览型号W25X32BVSSIG的Datasheet PDF文件第5页浏览型号W25X32BVSSIG的Datasheet PDF文件第6页浏览型号W25X32BVSSIG的Datasheet PDF文件第7页 
W25X32BV  
32M-BIT  
SERIAL FLASH MEMORY WITH  
4KB SECTORS AND DUAL OUTPUT SPI  
The W25Q32BV is recommended for all new 32Mb designs. The W25X32BV is  
available for existing designs that require "25X" device ID for firmware  
compatibility.  
Publication Release Date: October 7, 2009  
Preliminary -- Revision C  
- 1-  

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