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W25X32-VSSI-Z PDF预览

W25X32-VSSI-Z

更新时间: 2024-09-20 20:57:51
品牌 Logo 应用领域
华邦 - WINBOND 可编程只读存储器时钟光电二极管内存集成电路
页数 文件大小 规格书
47页 1317K
描述
32MX1 FLASH 2.7V PROM, PDSO8, 0.208 INCH, ROHS COMPLIANT, SOIC-8

W25X32-VSSI-Z 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:0.208 INCH, ROHS COMPLIANT, SOIC-8针数:8
Reach Compliance Code:unknown风险等级:5.84
最大时钟频率 (fCLK):33 MHzJESD-30 代码:S-PDSO-G8
JESD-609代码:e3长度:5.283 mm
内存密度:33554432 bit内存集成电路类型:FLASH
内存宽度:1湿度敏感等级:3
功能数量:1端子数量:8
字数:33554432 words字数代码:32000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:32MX1
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装形状:SQUARE封装形式:SMALL OUTLINE
并行/串行:SERIAL峰值回流温度(摄氏度):260
编程电压:2.7 V认证状态:Not Qualified
座面最大高度:2.16 mm最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES温度等级:INDUSTRIAL
端子面层:MATTE TIN端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:40宽度:5.283 mm
Base Number Matches:1

W25X32-VSSI-Z 数据手册

 浏览型号W25X32-VSSI-Z的Datasheet PDF文件第2页浏览型号W25X32-VSSI-Z的Datasheet PDF文件第3页浏览型号W25X32-VSSI-Z的Datasheet PDF文件第4页浏览型号W25X32-VSSI-Z的Datasheet PDF文件第5页浏览型号W25X32-VSSI-Z的Datasheet PDF文件第6页浏览型号W25X32-VSSI-Z的Datasheet PDF文件第7页 
W25X16, W25X32, W25X64  
16M-BIT, 32M-BIT, AND 64M-BIT  
SERIAL FLASH MEMORY WITH  
4KB SECTORS AND DUAL OUTPUT SPI  
Publication Release Date: June 28, 2006  
Preliminary - Revision B  
- 1 -  

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