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W25X16VDAI PDF预览

W25X16VDAI

更新时间: 2024-11-25 03:06:51
品牌 Logo 应用领域
华邦 - WINBOND 闪存输出元件
页数 文件大小 规格书
47页 1293K
描述
16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X16VDAI 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:DIP包装说明:DIP, DIP8,.3
针数:8Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.89最大时钟频率 (fCLK):33 MHz
数据保留时间-最小值:20耐久性:100000 Write/Erase Cycles
JESD-30 代码:R-PDIP-T8长度:9.14 mm
内存密度:16777216 bit内存集成电路类型:FLASH
内存宽度:1湿度敏感等级:1
功能数量:1端子数量:8
字数:16777216 words字数代码:16000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:16MX1
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装等效代码:DIP8,.3封装形状:RECTANGULAR
封装形式:IN-LINE并行/串行:SERIAL
峰值回流温度(摄氏度):225电源:3/3.3 V
编程电压:2.7 V认证状态:Not Qualified
座面最大高度:4.45 mm串行总线类型:SPI
最大待机电流:0.00001 A子类别:Flash Memories
最大压摆率:0.025 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:NO技术:CMOS
温度等级:INDUSTRIAL端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED类型:NOR TYPE
宽度:7.62 mm写保护:HARDWARE/SOFTWARE
Base Number Matches:1

W25X16VDAI 数据手册

 浏览型号W25X16VDAI的Datasheet PDF文件第2页浏览型号W25X16VDAI的Datasheet PDF文件第3页浏览型号W25X16VDAI的Datasheet PDF文件第4页浏览型号W25X16VDAI的Datasheet PDF文件第5页浏览型号W25X16VDAI的Datasheet PDF文件第6页浏览型号W25X16VDAI的Datasheet PDF文件第7页 
W25X16, W25X32, W25X64  
16M-BIT, 32M-BIT, AND 64M-BIT  
SERIAL FLASH MEMORY WITH  
4KB SECTORS AND DUAL OUTPUT SPI  
Publication Release Date:  
- 1 -  
February 26, 2007, Revision E  

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