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W25X16BVZPIG PDF预览

W25X16BVZPIG

更新时间: 2024-11-21 08:08:23
品牌 Logo 应用领域
华邦 - WINBOND 闪存输出元件
页数 文件大小 规格书
47页 1510K
描述
16M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X16BVZPIG 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:SON包装说明:6 X 5 MM, GREEN, WSON-8
针数:8Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.83最大时钟频率 (fCLK):80 MHz
数据保留时间-最小值:20耐久性:100000 Write/Erase Cycles
JESD-30 代码:R-PDSO-N8长度:6 mm
内存密度:4194304 bit内存集成电路类型:FLASH
内存宽度:16功能数量:1
端子数量:8字数:262144 words
字数代码:256000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:256KX16封装主体材料:PLASTIC/EPOXY
封装代码:HVSON封装等效代码:SOLCC8,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
并行/串行:SERIAL电源:3/3.3 V
编程电压:2.7 V认证状态:Not Qualified
座面最大高度:0.8 mm串行总线类型:SPI
最大待机电流:0.000005 A子类别:Flash Memories
最大压摆率:0.0165 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:NO LEAD端子节距:1.27 mm
端子位置:DUAL类型:NOR TYPE
宽度:5 mm写保护:HARDWARE/SOFTWARE
Base Number Matches:1

W25X16BVZPIG 数据手册

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W25X16BV  
16M-BIT  
SERIAL FLASH MEMORY WITH  
4KB SECTORS AND DUAL OUTPUT SPI  
The W25Q16BV is recommended for all new 16Mb designs. The W25X16BV is  
available for existing designs that require "25X" device ID for firmware  
compatibility.  
Publication Release Date: October 7, 2009  
Preliminary -- Revision C  
- 1-  

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