是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | SOIC | 包装说明: | 0.300 INCH, GREEN, SOIC-16 |
针数: | 16 | Reach Compliance Code: | unknown |
ECCN代码: | 3A991.B.1.A | HTS代码: | 8542.32.00.51 |
风险等级: | 5.72 | Is Samacsys: | N |
最大时钟频率 (fCLK): | 80 MHz | 数据保留时间-最小值: | 20 |
耐久性: | 100000 Write/Erase Cycles | JESD-30 代码: | R-PDSO-G16 |
长度: | 10.31 mm | 内存密度: | 67108864 bit |
内存集成电路类型: | FLASH | 内存宽度: | 1 |
功能数量: | 1 | 端子数量: | 16 |
字数: | 67108864 words | 字数代码: | 64000000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 105 °C |
最低工作温度: | -40 °C | 组织: | 64MX1 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SOP |
封装等效代码: | SOP16,.4 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 并行/串行: | SERIAL |
电源: | 3/3.3 V | 编程电压: | 2.7 V |
认证状态: | Not Qualified | 座面最大高度: | 2.64 mm |
串行总线类型: | SPI | 最大待机电流: | 0.000005 A |
子类别: | Flash Memories | 最大压摆率: | 0.025 mA |
最大供电电压 (Vsup): | 3.6 V | 最小供电电压 (Vsup): | 2.7 V |
标称供电电压 (Vsup): | 3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子形式: | GULL WING | 端子节距: | 1.27 mm |
端子位置: | DUAL | 类型: | NOR TYPE |
宽度: | 7.49 mm | 写保护: | HARDWARE/SOFTWARE |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
W25Q64CVSFAP | WINBOND |
获取价格 |
3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI | |
W25Q64CVSFIG | WINBOND |
获取价格 |
3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI | |
W25Q64CVSFIP | WINBOND |
获取价格 |
3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI | |
W25Q64CVSSAG | WINBOND |
获取价格 |
3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI | |
W25Q64CVSSAP | WINBOND |
获取价格 |
3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI | |
W25Q64CVSSIG | WINBOND |
获取价格 |
3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI | |
W25Q64CVSSIP | WINBOND |
获取价格 |
3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI | |
W25Q64CVSTIG | WINBOND |
获取价格 |
3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI | |
W25Q64CVTBIG | WINBOND |
获取价格 |
3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI | |
W25Q64CVTCAG | WINBOND |
获取价格 |
3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |