是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 包装说明: | TFBGA-24 |
Reach Compliance Code: | compliant | 风险等级: | 5.74 |
其他特性: | 2.7V NOMINAL AVAILABLE WITH 104MHZ | 备用内存宽度: | 1 |
最大时钟频率 (fCLK): | 133 MHz | JESD-30 代码: | R-PBGA-B24 |
JESD-609代码: | e1 | 长度: | 8 mm |
内存密度: | 33554432 bit | 内存集成电路类型: | FLASH |
内存宽度: | 8 | 功能数量: | 1 |
端子数量: | 24 | 字数: | 4194304 words |
字数代码: | 4000000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 4MX8 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TBGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, THIN PROFILE | 并行/串行: | SERIAL |
峰值回流温度(摄氏度): | 260 | 编程电压: | 3 V |
座面最大高度: | 1.2 mm | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 3 V | 标称供电电压 (Vsup): | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 6 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
W25Q32JVXGIQ | WINBOND |
获取价格 |
3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI | |
W25Q32JVZPIM | WINBOND |
获取价格 |
Flash, 4MX8, PDSO8, WSON-8 | |
W25Q32JVZPIQ | WINBOND |
获取价格 |
3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI | |
W25Q32JWSFIM | WINBOND |
获取价格 |
Flash Memory, | |
W25Q32V | WINBOND |
获取价格 |
32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI | |
W25Q32VSFIG | WINBOND |
获取价格 |
32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI | |
W25Q32VSSIG | WINBOND |
获取价格 |
32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI | |
W25Q32VZEIG | WINBOND |
获取价格 |
32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI | |
W25Q32VZPIG | WINBOND |
获取价格 |
32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI | |
W25Q40BL | WINBOND |
获取价格 |
2.5V 4M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |