是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | SOIC | 包装说明: | SOP, |
针数: | 8 | Reach Compliance Code: | unknown |
风险等级: | 5.88 | 最大时钟频率 (fCLK): | 25 MHz |
JESD-30 代码: | S-PDSO-G8 | JESD-609代码: | e0 |
长度: | 5.283 mm | 内存密度: | 16777216 bit |
内存集成电路类型: | FLASH | 内存宽度: | 1 |
功能数量: | 1 | 端子数量: | 8 |
字数: | 16777216 words | 字数代码: | 16000000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 16MX1 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SOP |
封装形状: | SQUARE | 封装形式: | SMALL OUTLINE |
并行/串行: | SERIAL | 峰值回流温度(摄氏度): | 240 |
编程电压: | 2.7 V | 认证状态: | Not Qualified |
座面最大高度: | 2.16 mm | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 2.7 V | 标称供电电压 (Vsup): | 3 V |
表面贴装: | YES | 温度等级: | INDUSTRIAL |
端子面层: | TIN LEAD | 端子形式: | GULL WING |
端子节距: | 1.27 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 5.283 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
W25P16VSSIG | WINBOND |
获取价格 |
8M-BIT AND 16M-BIT SERIAL FLASH MEMORY | |
W25P20 | WINBOND |
获取价格 |
1M-BIT, 2M-BIT AND 4M-BIT SERIAL FLASH MEMORY WITH 40MHZ SPI | |
W25P20-VNI | WINBOND |
获取价格 |
1M-BIT, 2M-BIT AND 4M-BIT SERIAL FLASH MEMORY WITH 40MHZ SPI | |
W25P20-VNIG | WINBOND |
获取价格 |
1M-BIT, 2M-BIT AND 4M-BIT SERIAL FLASH MEMORY WITH 40MHZ SPI | |
W25P20-VSNI | WINBOND |
获取价格 |
1M-BIT, 2M-BIT AND 4M-BIT SERIAL FLASH MEMORY WITH 40MHZ SPI | |
W25P20-VSNIG | WINBOND |
获取价格 |
1M-BIT, 2M-BIT AND 4M-BIT SERIAL FLASH MEMORY WITH 40MHZ SPI | |
W25P20-VSNI-G | WINBOND |
获取价格 |
Flash, 2MX1, PDSO8, 0.150 INCH, GREEN, PLASTIC, SOIC-8 | |
W25P222A | WINBOND |
获取价格 |
64K X 32 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM | |
W25P222A-4 | WINBOND |
获取价格 |
64K X 32 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM | |
W25P222A-4A | WINBOND |
获取价格 |
64K X 32 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM |