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W24B02Q-55LE PDF预览

W24B02Q-55LE

更新时间: 2024-09-27 05:17:35
品牌 Logo 应用领域
华邦 - WINBOND 静态存储器光电二极管内存集成电路
页数 文件大小 规格书
11页 194K
描述
Standard SRAM, 256KX8, 55ns, CMOS, PDSO32, 8 X 13.40 MM, TSOP1-32

W24B02Q-55LE 技术参数

生命周期:Obsolete零件包装代码:TSOP1
包装说明:TSOP1, TSSOP32,.56,20针数:32
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.84
最长访问时间:55 nsI/O 类型:COMMON
JESD-30 代码:R-PDSO-G32JESD-609代码:e3
长度:11.8 mm内存密度:2097152 bit
内存集成电路类型:STANDARD SRAM内存宽度:8
功能数量:1端子数量:32
字数:262144 words字数代码:256000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-20 °C组织:256KX8
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TSOP1封装等效代码:TSSOP32,.56,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
并行/串行:PARALLEL电源:3/3.3 V
认证状态:Not Qualified座面最大高度:1.2 mm
最小待机电流:1.5 V子类别:SRAMs
最大压摆率:0.02 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子面层:MATTE TIN
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL宽度:8 mm
Base Number Matches:1

W24B02Q-55LE 数据手册

 浏览型号W24B02Q-55LE的Datasheet PDF文件第2页浏览型号W24B02Q-55LE的Datasheet PDF文件第3页浏览型号W24B02Q-55LE的Datasheet PDF文件第4页浏览型号W24B02Q-55LE的Datasheet PDF文件第5页浏览型号W24B02Q-55LE的Datasheet PDF文件第6页浏览型号W24B02Q-55LE的Datasheet PDF文件第7页 
Preliminary W24B02  
´ 8 CMOS STATIC RAM  
256K  
GENERAL DESCRIPTION  
The W24B02 is a normal-speed, very low-power CMOS static RAM organized as 262144 x 8 bits that  
operates on a wide voltage range from 2.7V to 3.6V power supply. The W24B02, W24B02-LE and  
W24B02-LI, can meet the requirement of various operating temperature. This device is manufactured  
using Winbond’s high performance CMOS technology.  
FEATURES  
· Low power consumption  
· Three-state outputs  
· Access time: 55/70 nS  
· 2.7V to 3.6V supply voltage  
· Fully static operation  
· Battery back-up operation capability  
· Data retention voltage: 1.5V (min.)  
· Available packages: TFBGA and 32-pin Type  
· All inputs and outputs directly TTL compatible  
one TSOP (8 x 13.4 mm and 8 x 20 mm)  
PIN CONFIGURATIONS  
BLOCK DIAGRAM  
PRECHARGE CKT.  
CLK GEN.  
A18  
A17  
A16  
A15  
A14  
#OE  
A10  
#CS  
I/O8  
I/O7  
I/O6  
I/O5  
I/O4  
Vss  
I/O3  
I/O2  
I/O1  
A0  
A1  
A2  
A3  
A11  
A9  
A8  
1
2
3
4
5
6
7
8
9
32  
31  
R
O
W
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
CORE CELL ARRAY  
1024 ROWS  
A13  
#WE  
NC  
A15  
VDD  
A17  
A16  
A14  
A12  
A7  
A6  
A5  
A4  
D
E
C
O
D
E
R
256 X 8 COLUMNS  
A13  
A12  
A10  
A8  
32-pin  
TSOP  
10  
11  
12  
13  
14  
15  
16  
A7  
I/O1  
:
I/O8  
I/O CKT.  
COLUMN DECODER  
19  
18  
17  
DATA  
CNTRL.  
CLK  
GEN.  
A4  
A2  
A1 A0  
A11 A9 A6 A5  
A3  
#WE  
#CS  
#OE  
TFBGA TOP VIEW  
1
2
3
4
5
6
A
B
C
D
E
F
A1  
A2  
A0  
NC  
A3  
A4  
A5  
A8  
A6  
A7  
PIN DESCRIPTION  
I/O5  
I/O6  
I/O1  
I/O2  
#WE  
NC  
SYMBOL  
DESCRIPTION  
Address Inputs  
Data Inputs/Outputs  
A0 - A17  
I/O1 - I/O8  
#CS  
V
V
SS  
DD  
V
DD  
V
SS  
Chip Select Input  
Write Enable Input  
Output Enable Input  
Power Supply  
I/O7  
A17  
A16  
A12  
I/O3  
I/O4  
A14  
NC  
#CS  
A11  
#WE  
G
H
#OE  
A10  
I/O8  
A9  
A15  
A13  
#OE  
VDD  
VSS  
Ground  
NC  
No Connection  
Publication Release Date: May 6, 2002  
Revision A1  
- 1 -  

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